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MC68LC060RC66

68060 Microprocessor M680x0 Series MC68LC060 206-BPGA


  • Manufacturer: NXP USA Inc.
  • Nocochips NO: 568-MC68LC060RC66
  • Package: 206-BPGA
  • Datasheet: PDF
  • Stock: 418
  • Description: 68060 Microprocessor M680x0 Series MC68LC060 206-BPGA (Kg)

Details

Tags

Parameters
Packaging Tray
Published 1995
Series M680x0
Part Status Obsolete
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Base Part Number MC68LC060
Speed 66MHz
Core Processor 68060
Voltage - I/O 5.0V
Number of Cores/Bus Width 1 Core 32-Bit
Graphics Acceleration No
Additional Interfaces SCI, SPI
RoHS Status ROHS3 Compliant
Package / Case 206-BPGA
Supplier Device Package 206-PGA (47.25x47.25)
Operating Temperature 0°C~70°C TA

MC68LC060RC66 Description


The superscalar MC68LC060RC66 represents a new line of NXP? Semiconductors microprocessor products. The MC68LC060RC66 offers superscalar integer performance of over 110 MIPS at 75 MHz. The MC68LC060RC66 is fully equipped with a floating-point unit (FPU) and a memory management unit (MMU) for high-performance embedded control applications. For cost-sensitive embedded control and desktop applications where an MMU is required, but the additional cost of an FPU is not justified, the MC68LC060RC66 offers high performance at a low cost. Designed explicitly for low-cost embedded control applications, the MC68LC060RC66 eliminates both the FPU and MMU, permitting designers to leverage MC68LC060RC66 performance while avoiding the cost of unnecessary features.



MC68LC060RC66 Features


  • Independent Instruction and Data Memory Management Units (MMUs)

  • 32-Bit Logical Address Translation to 32-Bit Physical Address

  • User-Defined 2-Bit Physical Address Extension

  • Addresses Translated in Parallel with Indexing into Data or Instruction Cache

  • 64-Entry Four-Way Set-Associative Address Translation Cache (ATC) for Each MMU (128 Total Entries)

  • Global Bit Allowing Flushes of All Nonglobal Entries from ATCs

  • Selectable 4- or 8-Kbyte Page Size



MC68LC060RC66 Applications


  • Body electronics & lighting

  • Hybrid, electric & powertrain systems

  • Infotainment & cluster

  • Broadband fixed line access

  • Datacom module

  • Wired networking

  • Wireless infrastructure


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