MC68MH360ZP25L
| Parameters | |
|---|---|
| Package / Case | 357-BGA |
| Operating Temperature | 0°C~70°C TA |
| Packaging | Tray |
| Series | M683xx |
| Part Status | Obsolete |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Base Part Number | MC68MH360 |
| Speed | 25MHz |
| Core Processor | CPU32+ |
| Voltage - I/O | 5.0V |
| Ethernet | 10Mbps (1) |
| Number of Cores/Bus Width | 1 Core 32-Bit |
| Graphics Acceleration | No |
| RAM Controllers | DRAM |
| Additional Interfaces | SCC, SMC, SPI |
| Co-Processors/DSP | Communications; CPM |
| RoHS Status | Non-RoHS Compliant |
MC68MH360ZP25L Overview
With a packing size of 357-BGA, this embedded microprocessor is ideal for international shipping. Advanced packaging method Tray is used to provide high reliability. This CPU has 1 Core 32-Bit cores and 1 Core 32-Bit bus widths. The operating temperature around 0°C~70°C TA should be understood. In the M683xx series, it is found. CPU32+ is the processor core of this CPU. A CPU with this architecture uses DRAM RAM controllers. This microprocessor features SCC, SMC, SPI interfaces to better serve its users. There is 5.0V I/O running on this CPU. Using MC68MH360 will help you find variants of the cpu microprocessor.
MC68MH360ZP25L Features
CPU32+ Core
MC68MH360ZP25L Applications
There are a lot of NXP USA Inc. MC68MH360ZP25L Microprocessor applications.
- Washing machine
- Industrial instrumentation devices
- Network communication, mobile communication field
- Gas monitoring systems
- Toys
- Dishwashers
- Plant factories (special plant factories, soilless cultivation technology, smart seed engineering)
- Data acquisition and control
- Multi-meter
- Computer/laptop
