Parameters |
Package / Case |
357-BBGA |
Supplier Device Package |
357-PBGA (25x25) |
Operating Temperature |
0°C~70°C TA |
Packaging |
Tray |
Published |
1997 |
Series |
M683xx |
Part Status |
Obsolete |
Moisture Sensitivity Level (MSL) |
3 (168 Hours) |
Base Part Number |
MC68MH360 |
Speed |
25MHz |
Core Processor |
CPU32+ |
Voltage - I/O |
5.0V |
Ethernet |
10Mbps (1) |
Number of Cores/Bus Width |
1 Core 32-Bit |
Graphics Acceleration |
No |
RAM Controllers |
DRAM |
Additional Interfaces |
SCC, SMC, SPI |
Co-Processors/DSP |
Communications; CPM |
RoHS Status |
Non-RoHS Compliant |
MC68MH360ZQ25L Overview
Since the microprocessor is packed in 357-BBGA, shipping overseas is convenient. High reliability is achieved using advanced packaging method Tray. There are 1 Core 32-Bit cores/bus width on the CPU. It is important to understand the operating temperature around 0°C~70°C TA. It comes from the M683xx series. Core-wise, this CPU has a CPU32+ processor. A CPU with this architecture uses DRAM RAM controllers. Microprocessors with SCC, SMC, SPI interfaces are designed to serve users better. At 5.0V, the CPU runs its I/O. The microprocessor can be searched for with MC68MH360 if you are looking for variants. Suppliers offer the package 357-PBGA (25x25).
MC68MH360ZQ25L Features
CPU32+ Core
MC68MH360ZQ25L Applications
There are a lot of NXP USA Inc. MC68MH360ZQ25L Microprocessor applications.
- Fire detection & safety devices
- Routers
- Computed Tomography (CT scan)
- Oscilloscopes
- Accu-check
- Projectors
- Scanners
- Information appliances (networking of household appliances)
- Nintendo
- Oil and gas