Parameters |
Package / Case |
357-BBGA |
Supplier Device Package |
357-PBGA (25x25) |
Operating Temperature |
0°C~70°C TA |
Packaging |
Tape & Reel (TR) |
Published |
1997 |
Series |
M683xx |
Part Status |
Obsolete |
Moisture Sensitivity Level (MSL) |
3 (168 Hours) |
Base Part Number |
MC68MH360 |
Speed |
33MHz |
Core Processor |
CPU32+ |
Voltage - I/O |
5.0V |
Ethernet |
10Mbps (1) |
Number of Cores/Bus Width |
1 Core 32-Bit |
Graphics Acceleration |
No |
RAM Controllers |
DRAM |
Additional Interfaces |
SCC, SMC, SPI |
Co-Processors/DSP |
Communications; CPM |
RoHS Status |
Non-RoHS Compliant |
MC68MH360ZQ33LR2 Overview
The embedded microprocessor has been packed in 357-BBGA for convenient overseas shipping. Advanced packaging method Tape & Reel (TR) is used to provide high reliability. 1 Core 32-Bit cores/Bus width are present in the CPU. It is important to understand the operating temperature around 0°C~70°C TA. In the M683xx series, it is found. The CPU is cored by a processor with a number of 0 cores. A CPU with this architecture uses DRAM RAM controllers. Microprocessors with SCC, SMC, SPI interfaces are designed to serve users better. There is 5.0V I/O running on this CPU. To find variants of the microprocessor, try searching with MC68MH360. There is a 357-PBGA (25x25) package offered by suppliers.
MC68MH360ZQ33LR2 Features
CPU32+ Core
MC68MH360ZQ33LR2 Applications
There are a lot of NXP USA Inc. MC68MH360ZQ33LR2 Microprocessor applications.
- Multi-meter
- Set-top boxes
- Fax machines
- Oscilloscopes
- Mobile computers
- Microwave ovens
- Process control devices
- Light sensing & controlling devices
- Fire alarms
- Mice