Parameters |
Mounting Type |
Surface Mount |
Package / Case |
20-TSSOP (0.173, 4.40mm Width) |
Surface Mount |
YES |
Operating Temperature |
-55°C~125°C TA |
Packaging |
Tube |
Series |
74LCX |
JESD-609 Code |
e4 |
Pbfree Code |
yes |
Part Status |
Obsolete |
Moisture Sensitivity Level (MSL) |
1 (Unlimited) |
Number of Terminations |
20 |
Terminal Finish |
NICKEL PALLADIUM GOLD |
Technology |
CMOS |
Voltage - Supply |
2V~5.5V |
Terminal Position |
DUAL |
Terminal Form |
GULL WING |
Peak Reflow Temperature (Cel) |
260 |
Number of Functions |
2 |
Supply Voltage |
2.5V |
Terminal Pitch |
0.65mm |
Time@Peak Reflow Temperature-Max (s) |
40 |
Pin Count |
20 |
Qualification Status |
Not Qualified |
Output Type |
3-State |
Number of Elements |
2 |
Supply Voltage-Max (Vsup) |
3.6V |
Supply Voltage-Min (Vsup) |
2V |
Number of Ports |
2 |
Family |
LVC/LCX/Z |
Current - Output High, Low |
24mA 24mA |
Logic Type |
Buffer, Non-Inverting |
Output Polarity |
TRUE |
Number of Bits per Element |
4 |
Propagation Delay (tpd) |
7.8 ns |
Length |
6.5mm |
RoHS Status |
ROHS3 Compliant |
MC74LCX244DT Overview
Logical driver uses a neat 20-TSSOP (0.173, 4.40mm Width) package. Tube external packaging. Available in Surface Mount. Voltage buffer adopts Buffer, Non-Inverting logic prototype. Buffer IC is fed with a voltage of 2V~5.5V. Qualified to operate within -55°C~125°C TA. The high and low logic state output current of logical driver is 24mA 24mA. Logical driver can deal with 3-State output (s). All of the 2 elements are put into use. Digital buffer is one of the 74LCX series devices. 20 terminations with different functions. Buffer IC reuqires a supply voltage of 2.5V. This electronic part belongs to the LVC/LCX/Z family of parts. 20 pins are set with the electric part. Enhanced with 2 ports. The bus transceiver employs 4 bits for each element. To supply the device, a minimum voltage of 2V is a must.
MC74LCX244DT Features
MC74LCX244DT Applications
There are a lot of Rochester Electronics, LLC MC74LCX244DT Buffers & Transceivers applications.
- Interconnection between switches and computers
- LAN, SAN, WAN (local, storage, work area networks)
- Solenoids
- Structural bonding
- Wireless 3D game
- Data center
- Laser diode bonding
- interconnection between switches
- Wireless multimedia center in smart home
- Satellite communication