Parameters |
Factory Lead Time |
1 Week |
Package / Case |
357-BBGA |
Operating Temperature |
-40°C~95°C TA |
Packaging |
Tape & Reel (TR) |
Published |
1995 |
Series |
MPC8xx |
Part Status |
Not For New Designs |
Moisture Sensitivity Level (MSL) |
3 (168 Hours) |
Base Part Number |
MC860 |
Speed |
50MHz |
Voltage - I/O |
3.3V |
Ethernet |
10Mbps (4) |
Number of Cores/Bus Width |
1 Core 32-Bit |
Graphics Acceleration |
No |
RAM Controllers |
DRAM |
Additional Interfaces |
I2C, IrDA, PCMCIA, SPI, TDM, UART/USART |
Co-Processors/DSP |
Communications; CPM |
RoHS Status |
Non-RoHS Compliant |
MC860ENCZQ50D4R2 Overview
Shipping overseas is convenient thanks to the embedded microprocessor's packaging in 357-BBGA. High reliability is provided by the advanced packaging method Tape & Reel (TR). There are 1 Core 32-Bit cores/bus width on the CPU. Identify the operating temperature around -40°C~95°C TA. In the series MPC8xx, it is found. The CPU contains DRAM RAM controllers. The microprocessor features interfaces I2C, IrDA, PCMCIA, SPI, TDM, UART/USART for better service. At 3.3V, the CPU runs its I/O. Try searching for variants of the cpu microprocessor with MC860.
MC860ENCZQ50D4R2 Features
MC860ENCZQ50D4R2 Applications
There are a lot of NXP USA Inc. MC860ENCZQ50D4R2 Microprocessor applications.
- Fax machines
- Firewalls
- Instrumentation and process control field
- Fabric
- Industrial control field
- Routers
- Digital set-top boxes
- Industrial instrumentation devices
- Home video and audio
- Washing machines