Parameters | |
---|---|
Factory Lead Time | 1 Week |
Mounting Type | Surface Mount |
Package / Case | 3-SMD, Flat Lead |
Surface Mount | YES |
Number of Pins | 3 |
Transistor Element Material | SILICON |
Operating Temperature | 150°C TJ |
Packaging | Tape & Reel (TR) |
Published | 2012 |
JESD-609 Code | e6 |
Pbfree Code | yes |
Part Status | Not For New Designs |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
Number of Terminations | 3 |
ECCN Code | EAR99 |
Terminal Finish | Tin/Bismuth (Sn/Bi) |
Technology | MOSFET (Metal Oxide) |
Terminal Position | DUAL |
Pin Count | 3 |
Number of Elements | 1 |
Power Dissipation-Max | 1W Ta |
Element Configuration | Single |
Operating Mode | ENHANCEMENT MODE |
Power Dissipation | 1W |
Turn On Delay Time | 7.5 ns |
FET Type | N-Channel |
Transistor Application | SWITCHING |
Rds On (Max) @ Id, Vgs | 38m Ω @ 2A, 4.5V |
Halogen Free | Halogen Free |
Input Capacitance (Ciss) (Max) @ Vds | 410pF @ 10V |
Current - Continuous Drain (Id) @ 25°C | 4.5A Ta |
Gate Charge (Qg) (Max) @ Vgs | 5.1nC @ 4.5V |
Rise Time | 26ns |
Drive Voltage (Max Rds On,Min Rds On) | 1.8V 4.5V |
Vgs (Max) | ±12V |
Fall Time (Typ) | 32 ns |
Turn-Off Delay Time | 38 ns |
Continuous Drain Current (ID) | 4.5A |
Gate to Source Voltage (Vgs) | 12V |
Drain to Source Breakdown Voltage | 20V |
Height | 850μm |
Length | 2mm |
Width | 1.6mm |
Radiation Hardening | No |
RoHS Status | ROHS3 Compliant |
Lead Free | Lead Free |