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MCIMX534AVV8B

ARM? Cortex?-A8 Microprocessor i.MX53 Series MCIMX534 529-FBGA


  • Manufacturer: NXP USA Inc.
  • Nocochips NO: 568-MCIMX534AVV8B
  • Package: 529-FBGA
  • Datasheet: -
  • Stock: 816
  • Description: ARM? Cortex?-A8 Microprocessor i.MX53 Series MCIMX534 529-FBGA (Kg)

Details

Tags

Parameters
Package / Case 529-FBGA
Operating Temperature -40°C~125°C TJ
Packaging Tray
Series i.MX53
Part Status Obsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Base Part Number MCIMX534
Speed 800MHz
Core Processor ARM® Cortex®-A8
Voltage - I/O 1.3V 1.8V 2.775V 3.3V
Ethernet 10/100Mbps (1)
Number of Cores/Bus Width 1 Core 32-Bit
Graphics Acceleration Yes
RAM Controllers LPDDR2, DDR2, DDR3
USB USB 2.0 (2), USB 2.0 + PHY (2)
Additional Interfaces 1-Wire, AC'97, CAN, I2C, I2S, MMC/SD, SAI, SPI, SSI, UART
Co-Processors/DSP Multimedia; NEON™ SIMD
Security Features ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Display & Interface Controllers Keypad, LCD
SATA SATA 1.5Gbps (1)
RoHS Status ROHS3 Compliant

MCIMX534AVV8B Overview


Since the microprocessor is packed in 529-FBGA, shipping overseas is convenient. Using advanced packaging techniques Tray, high reliability is ensured. In the CPU, there are 1 Core 32-Bit cores and 1 Core 32-Bit bus width. The operating temperature around -40°C~125°C TJ should be understood. The cpu microprocessor belongs to the i.MX53 series. ARM? Cortex?-A8 is the processor core of this CPU. A total of LPDDR2, DDR2, DDR3 RAM controllers are used by this CPU. A 1-Wire, AC'97, CAN, I2C, I2S, MMC/SD, SAI, SPI, SSI, UART interface has been added to this microprocessor in order to serve the user better. As far as I/O is concerned, this CPU runs at 1.3V 1.8V 2.775V 3.3V. MCIMX534 is a good way to search for variants of the microprocessor.

MCIMX534AVV8B Features


ARM? Cortex?-A8 Core

MCIMX534AVV8B Applications


There are a lot of NXP USA Inc. MCIMX534AVV8B Microprocessor applications.

  • Embedded gateways
  • DVD\DV\MP3 players
  • Information appliances (networking of household appliances)
  • Communication-bluetooth, Wi-Fi, radio
  • Microwave ovens
  • Robotic prosthetic limbs
  • Teletext terminals
  • PDAs, game consoles
  • Calculators
  • Smartphone

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