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MCIMX6D4AVT10AER

ARM? Cortex?-A9 Microprocessor i.MX6D Series 624-FBGA, FCBGA


  • Manufacturer: NXP USA Inc.
  • Nocochips NO: 568-MCIMX6D4AVT10AER
  • Package: 624-FBGA, FCBGA
  • Datasheet: PDF
  • Stock: 517
  • Description: ARM? Cortex?-A9 Microprocessor i.MX6D Series 624-FBGA, FCBGA (Kg)

Details

Tags

Parameters
Package / Case 624-FBGA, FCBGA
Operating Temperature -40°C~125°C TJ
Packaging Tape & Reel (TR)
Published 2002
Series i.MX6D
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Peak Reflow Temperature (Cel) 260
Time@Peak Reflow Temperature-Max (s) 40
Speed 1.0GHz
Core Processor ARM® Cortex®-A9
Voltage - I/O 1.8V 2.5V 2.8V 3.3V
Ethernet 10/100/1000Mbps (1)
Number of Cores/Bus Width 2 Core 32-Bit
Graphics Acceleration Yes
RAM Controllers LPDDR2, LVDDR3, DDR3
USB USB 2.0 + PHY (4)
Additional Interfaces CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
Co-Processors/DSP Multimedia; NEON™ SIMD
Security Features ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Display & Interface Controllers Keypad, LCD
SATA SATA 3Gbps (1)
RoHS Status ROHS3 Compliant
Factory Lead Time 1 Week

MCIMX6D4AVT10AER Overview


Shipping overseas is convenient since the embedded microprocessor is packed in 624-FBGA, FCBGA. In order to provide high reliability, advanced packaging method Tape & Reel (TR) is used. CPUs have 2 Core 32-Bit cores/bus width. Understand the operating temperature around -40°C~125°C TJ. The cpu microprocessor belongs to the i.MX6D series. This CPU is cored with a ARM? Cortex?-A9 processor. This CPU uses LPDDR2, LVDDR3, DDR3 RAM controllers. Microprocessors with CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART interfaces are designed to serve users better. The CPU runs I/O at 1.8V 2.5V 2.8V 3.3V.

MCIMX6D4AVT10AER Features


ARM? Cortex?-A9 Core

MCIMX6D4AVT10AER Applications


There are a lot of NXP USA Inc. MCIMX6D4AVT10AER Microprocessor applications.

  • Copiers
  • Binding machines
  • Process control devices
  • Hard drives
  • Industrial robot
  • X-ray
  • Network application field
  • DDC control
  • Magnetic resonance imaging (MRI)
  • Hand-held metering systems

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