Parameters |
Package / Case |
624-FBGA, FCBGA |
Operating Temperature |
-40°C~125°C TJ |
Packaging |
Tape & Reel (TR) |
Published |
2002 |
Series |
i.MX6D |
Part Status |
Active |
Moisture Sensitivity Level (MSL) |
3 (168 Hours) |
Peak Reflow Temperature (Cel) |
260 |
Time@Peak Reflow Temperature-Max (s) |
40 |
Speed |
1.0GHz |
Core Processor |
ARM® Cortex®-A9 |
Voltage - I/O |
1.8V 2.5V 2.8V 3.3V |
Ethernet |
10/100/1000Mbps (1) |
Number of Cores/Bus Width |
2 Core 32-Bit |
Graphics Acceleration |
Yes |
RAM Controllers |
LPDDR2, LVDDR3, DDR3 |
USB |
USB 2.0 + PHY (4) |
Additional Interfaces |
CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART |
Co-Processors/DSP |
Multimedia; NEON™ SIMD |
Security Features |
ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection |
Display & Interface Controllers |
Keypad, LCD |
SATA |
SATA 3Gbps (1) |
RoHS Status |
ROHS3 Compliant |
Factory Lead Time |
1 Week |
MCIMX6D4AVT10AER Overview
Shipping overseas is convenient since the embedded microprocessor is packed in 624-FBGA, FCBGA. In order to provide high reliability, advanced packaging method Tape & Reel (TR) is used. CPUs have 2 Core 32-Bit cores/bus width. Understand the operating temperature around -40°C~125°C TJ. The cpu microprocessor belongs to the i.MX6D series. This CPU is cored with a ARM? Cortex?-A9 processor. This CPU uses LPDDR2, LVDDR3, DDR3 RAM controllers. Microprocessors with CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART interfaces are designed to serve users better. The CPU runs I/O at 1.8V 2.5V 2.8V 3.3V.
MCIMX6D4AVT10AER Features
ARM? Cortex?-A9 Core
MCIMX6D4AVT10AER Applications
There are a lot of NXP USA Inc. MCIMX6D4AVT10AER Microprocessor applications.
- Copiers
- Binding machines
- Process control devices
- Hard drives
- Industrial robot
- X-ray
- Network application field
- DDC control
- Magnetic resonance imaging (MRI)
- Hand-held metering systems