Parameters |
Factory Lead Time |
1 Week |
Package / Case |
624-LFBGA, FCBGA |
Operating Temperature |
-20°C~105°C TJ |
Packaging |
Tape & Reel (TR) |
Published |
2011 |
Series |
i.MX6D |
Part Status |
Active |
Moisture Sensitivity Level (MSL) |
3 (168 Hours) |
Speed |
1.0GHz |
Core Processor |
ARM® Cortex®-A9 |
Voltage - I/O |
1.8V 2.5V 2.8V 3.3V |
Ethernet |
10/100/1000Mbps (1) |
Number of Cores/Bus Width |
2 Core 32-Bit |
Graphics Acceleration |
Yes |
RAM Controllers |
LPDDR2, LVDDR3, DDR3 |
USB |
USB 2.0 + PHY (4) |
Additional Interfaces |
CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART |
Co-Processors/DSP |
Multimedia; NEON™ SIMD |
Security Features |
ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection |
Display & Interface Controllers |
Keypad, LCD |
SATA |
SATA 3Gbps (1) |
RoHS Status |
ROHS3 Compliant |
MCIMX6D5EYM10ADR Overview
The embedded microprocessor ships overseas conveniently packed in 624-LFBGA, FCBGA. A high level of reliability is provided by using an advanced packaging method Tape & Reel (TR). The CPU has 2 Core 32-Bit cores/Bus width. Identify the operating temperature around -20°C~105°C TJ. In the i.MX6D series, it is found. Core-wise, this CPU has a ARM? Cortex?-A9 processor. A CPU with this architecture uses LPDDR2, LVDDR3, DDR3 RAM controllers. A CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART interface has been added to this microprocessor in order to serve the user better. As far as I/O is concerned, this CPU runs at 1.8V 2.5V 2.8V 3.3V.
MCIMX6D5EYM10ADR Features
ARM? Cortex?-A9 Core
MCIMX6D5EYM10ADR Applications
There are a lot of NXP USA Inc. MCIMX6D5EYM10ADR Microprocessor applications.
- Network communication, mobile communication field
- Computer/laptop
- Computers and laptops-video calling, email, blogging
- Paper shredders
- Television
- Data acquisition and control
- Monitoring-temperature level, oil level, speed, distance, acceleration
- DCS control intelligent sensor
- Vacuum cleaners
- Security systems