MCIMX6D5EYM10AE
| Parameters | |
|---|---|
| Factory Lead Time | 1 Week |
| Package / Case | 624-LFBGA, FCBGA |
| Operating Temperature | -20°C~105°C TJ |
| Packaging | Tray |
| Published | 2002 |
| Series | i.MX6D |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Peak Reflow Temperature (Cel) | 260 |
| Time@Peak Reflow Temperature-Max (s) | 40 |
| Speed | 1.0GHz |
| Core Processor | ARM® Cortex®-A9 |
| Voltage - I/O | 1.8V 2.5V 2.8V 3.3V |
| Ethernet | 10/100/1000Mbps (1) |
| Number of Cores/Bus Width | 2 Core 32-Bit |
| Graphics Acceleration | Yes |
| RAM Controllers | LPDDR2, LVDDR3, DDR3 |
| USB | USB 2.0 + PHY (4) |
| Additional Interfaces | CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART |
| Co-Processors/DSP | Multimedia; NEON™ SIMD |
| Security Features | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection |
| Display & Interface Controllers | Keypad, LCD |
| SATA | SATA 3Gbps (1) |
| RoHS Status | ROHS3 Compliant |
MCIMX6D5EYM10AE Overview
The microprocessor is convenient for international shipping since it is packaged in 624-LFBGA, FCBGA. High reliability can be achieved by using the advanced packaging method Tray. CPUs have 2 Core 32-Bit cores/bus width. The operating temperature around -20°C~105°C TJ should be understood. i.MX6D is its series number. ARM? Cortex?-A9 processors are embedded in this CPU. A CPU with this architecture uses LPDDR2, LVDDR3, DDR3 RAM controllers. The microprocessor features interfaces CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART for better service. In this CPU, I/O is set to 1.8V 2.5V 2.8V 3.3V.
MCIMX6D5EYM10AE Features
ARM? Cortex?-A9 Core
MCIMX6D5EYM10AE Applications
There are a lot of NXP USA Inc. MCIMX6D5EYM10AE Microprocessor applications.
- 8. Navigation control field
- Safety -airbags, automatic braking system (ABS)
- Smart instruments
- Dialysis machines (performs function of liver)
- Xbox
- Nintendo
- Industrial control field
- Firewalls
- Printers
- Robots
