Parameters |
Factory Lead Time |
1 Week |
Package / Case |
624-LFBGA, FCBGA |
Operating Temperature |
-20°C~105°C TJ |
Packaging |
Tray |
Series |
i.MX6D |
Part Status |
Active |
Moisture Sensitivity Level (MSL) |
3 (168 Hours) |
Speed |
1.0GHz |
Core Processor |
ARM® Cortex®-A9 |
Voltage - I/O |
1.8V 2.5V 2.8V 3.3V |
Ethernet |
10/100/1000Mbps (1) |
Number of Cores/Bus Width |
2 Core 32-Bit |
Graphics Acceleration |
Yes |
RAM Controllers |
LPDDR2, LVDDR3, DDR3 |
USB |
USB 2.0 + PHY (4) |
Additional Interfaces |
CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART |
Co-Processors/DSP |
Multimedia; NEON™ SIMD |
Security Features |
ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection |
Display & Interface Controllers |
Keypad, LCD |
SATA |
SATA 3Gbps (1) |
RoHS Status |
ROHS3 Compliant |
MCIMX6D5EYM10CE Overview
Due to its 624-LFBGA, FCBGA packaging, it is convenient to ship overseas. High reliability is achieved by using advanced packaging methods Tray. There are 2 Core 32-Bit cores/bus width on the CPU. Understand the operating temperature around -20°C~105°C TJ. In the series i.MX6D, it is found. With a core count of ARM? Cortex?-A9, this CPU is multicore. There are LPDDR2, LVDDR3, DDR3 RAM controllers used by this CPU. This microprocessor features CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART interfaces to better serve its users. There is 1.8V 2.5V 2.8V 3.3V I/O running on this CPU.
MCIMX6D5EYM10CE Features
ARM? Cortex?-A9 Core
MCIMX6D5EYM10CE Applications
There are a lot of NXP USA Inc. MCIMX6D5EYM10CE Microprocessor applications.
- Aerospace navigation systems
- Toasters
- Industrial robot
- Television
- Current meter
- Fabric
- DCS control intelligent sensor
- Consumer electronics products
- Process control devices
- Agriculture, transportation field