Parameters |
Factory Lead Time |
1 Week |
Package / Case |
569-LFBGA |
Operating Temperature |
-20°C~105°C TJ |
Packaging |
Tray |
Published |
2002 |
Series |
i.MX6D |
Part Status |
Active |
Moisture Sensitivity Level (MSL) |
3 (168 Hours) |
HTS Code |
8542.39.00.01 |
Peak Reflow Temperature (Cel) |
260 |
Time@Peak Reflow Temperature-Max (s) |
40 |
Speed |
800MHz |
Core Processor |
ARM® Cortex®-A9 |
Voltage - I/O |
1.8V 2.5V 2.8V 3.3V |
Ethernet |
10/100/1000Mbps (1) |
Number of Cores/Bus Width |
2 Core 32-Bit |
Graphics Acceleration |
Yes |
RAM Controllers |
LPDDR2, LVDDR3, DDR3 |
USB |
USB 2.0 + PHY (4) |
Additional Interfaces |
CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART |
Co-Processors/DSP |
Multimedia; NEON™ SIMD |
Security Features |
ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection |
Display & Interface Controllers |
Keypad, LCD |
SATA |
SATA 3Gbps (1) |
RoHS Status |
ROHS3 Compliant |
MCIMX6D5EZK08AE Overview
Since the microprocessor is packed in 569-LFBGA, shipping overseas is convenient. High reliability is achieved using advanced packaging method Tray. CPUs have 2 Core 32-Bit cores/bus width. Understand the operating temperature around -20°C~105°C TJ. i.MX6D is its series number. ARM? Cortex?-A9 is the processor core of this CPU. This CPU uses LPDDR2, LVDDR3, DDR3 RAM controllers. A CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART interface has been added to this microprocessor in order to serve the user better. There is 1.8V 2.5V 2.8V 3.3V I/O running on this CPU.
MCIMX6D5EZK08AE Features
ARM? Cortex?-A9 Core
MCIMX6D5EZK08AE Applications
There are a lot of NXP USA Inc. MCIMX6D5EZK08AE Microprocessor applications.
- Smartphones-calling, video calling, texting, email
- X-ray
- Measurement and control field
- Switches
- Gas monitoring systems
- Food and beverage
- Air fryers
- Process control devices
- DVD\DV\MP3 players
- Dialysis machines (performs function of liver)