MCIMX6D6AVT08AE

ARM? Cortex?-A9 Microprocessor i.MX6D Series 624-FBGA, FCBGA

Manufacturer: NXP USA Inc.
Nocochips NO: 568-MCIMX6D6AVT08AE
Package: 624-FBGA, FCBGA
Datasheet: PDF
Stock: 419
Description: ARM? Cortex?-A9 Microprocessor i.MX6D Series 624-FBGA, FCBGA (Kg)

Details

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Parameters
Factory Lead Time	1 Week
Package / Case	624-FBGA, FCBGA
Operating Temperature	-40°C~125°C TJ
Packaging	Tray
Published	2002
Series	i.MX6D
Part Status	Active
Moisture Sensitivity Level (MSL)	3 (168 Hours)
Peak Reflow Temperature (Cel)	260
Time@Peak Reflow Temperature-Max (s)	40
Speed	852MHz
Core Processor	ARM® Cortex®-A9
Voltage - I/O	1.8V 2.5V 2.8V 3.3V
Ethernet	10/100/1000Mbps (1)
Number of Cores/Bus Width	2 Core 32-Bit
Graphics Acceleration	Yes
RAM Controllers	LPDDR2, LVDDR3, DDR3
USB	USB 2.0 + PHY (4)
Additional Interfaces	CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
Co-Processors/DSP	Multimedia; NEON™ SIMD
Security Features	ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Display & Interface Controllers	Keypad, LCD
SATA	SATA 3Gbps (1)
RoHS Status	ROHS3 Compliant

MCIMX6D6AVT08AE Overview

Shipping overseas is convenient since the embedded microprocessor is packed in 624-FBGA, FCBGA. A high level of reliability is provided by using an advanced packaging method Tray. The CPU has 2 Core 32-Bit cores/Bus width. It is important to understand the operating temperature around -40°C~125°C TJ. The cpu microprocessor belongs to the i.MX6D series. A ARM? Cortex?-A9 processor powers this CPU. The CPU contains LPDDR2, LVDDR3, DDR3 RAM controllers. To serve better this microprocessor features CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART interfaces. In this CPU, I/O is set to 1.8V 2.5V 2.8V 3.3V.