Parameters |
Factory Lead Time |
1 Week |
Package / Case |
624-FBGA, FCBGA |
Operating Temperature |
-40°C~125°C TJ |
Packaging |
Tape & Reel (TR) |
Published |
2002 |
Series |
i.MX6D |
Part Status |
Active |
Moisture Sensitivity Level (MSL) |
3 (168 Hours) |
Peak Reflow Temperature (Cel) |
260 |
Time@Peak Reflow Temperature-Max (s) |
40 |
Speed |
1.0GHz |
Core Processor |
ARM® Cortex®-A9 |
Voltage - I/O |
1.8V 2.5V 2.8V 3.3V |
Ethernet |
10/100/1000Mbps (1) |
Number of Cores/Bus Width |
2 Core 32-Bit |
Graphics Acceleration |
Yes |
RAM Controllers |
LPDDR2, LVDDR3, DDR3 |
USB |
USB 2.0 + PHY (4) |
Additional Interfaces |
CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART |
Co-Processors/DSP |
Multimedia; NEON™ SIMD |
Security Features |
ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection |
Display & Interface Controllers |
Keypad, LCD |
SATA |
SATA 3Gbps (1) |
RoHS Status |
ROHS3 Compliant |
MCIMX6D6AVT10AER Overview
The embedded microprocessor has been packed in 624-FBGA, FCBGA for convenient overseas shipping. A high level of reliability is provided by using an advanced packaging method Tape & Reel (TR). CPUs have 2 Core 32-Bit cores/bus width. Extended operating temperature around -40°C~125°C TJ. From the i.MX6D series. A ARM? Cortex?-A9 processor powers this CPU. The CPU uses LPDDR2, LVDDR3, DDR3 RAM controllers. This microprocessor features interfaces CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART. This CPU runs I/O at 1.8V 2.5V 2.8V 3.3V.
MCIMX6D6AVT10AER Features
ARM? Cortex?-A9 Core
MCIMX6D6AVT10AER Applications
There are a lot of NXP USA Inc. MCIMX6D6AVT10AER Microprocessor applications.
- Light sensing & controlling devices
- Industrial control field
- Playstation
- Kindle
- Data acquisition and control
- Scanners
- Monitoring-temperature level, oil level, speed, distance, acceleration
- Smart highways (navigation, traffic control, information monitoring and car service)
- Smart instruments
- Missile control