Parameters | |
---|---|
ECCN Code | 5A992 |
HTS Code | 8542.31.00.01 |
Technology | CMOS |
Terminal Position | BOTTOM |
Terminal Form | BALL |
Peak Reflow Temperature (Cel) | 260 |
Terminal Pitch | 0.8mm |
Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
JESD-30 Code | S-PBGA-B624 |
Supply Voltage-Max (Vsup) | 1.5V |
Supply Voltage-Min (Vsup) | 1.275V |
Speed | 800MHz |
uPs/uCs/Peripheral ICs Type | MICROPROCESSOR, RISC |
Core Processor | ARM® Cortex®-A9 |
Clock Frequency | 24MHz |
Bit Size | 64 |
Address Bus Width | 16 |
Boundary Scan | YES |
Low Power Mode | YES |
External Data Bus Width | 64 |
Format | FIXED POINT |
Integrated Cache | YES |
Voltage - I/O | 1.8V 2.5V 2.8V 3.3V |
Ethernet | 10/100/1000Mbps (1) |
Number of Cores/Bus Width | 2 Core 32-Bit |
Graphics Acceleration | Yes |
RAM Controllers | LPDDR2, LVDDR3, DDR3 |
USB | USB 2.0 + PHY (4) |
Additional Interfaces | CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART |
Co-Processors/DSP | Multimedia; NEON™ SIMD |
Security Features | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection |
Display & Interface Controllers | Keypad, LCD |
SATA | SATA 3Gbps (1) |
Height Seated (Max) | 2.16mm |
Length | 21mm |
RoHS Status | ROHS3 Compliant |
Factory Lead Time | 1 Week |
Package / Case | 624-FBGA, FCBGA |
Surface Mount | YES |
Operating Temperature | -40°C~105°C TA |
Packaging | Tray |
Published | 2002 |
Series | i.MX6D |
Part Status | Active |
Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
Number of Terminations | 624 |
The MCIMX6D7CVT08AD processor is a part of a growing family of multimedia-focused products that offer high-performance processing and are optimized for the lowest power consumption. The MCIMX6D7CVT08AD processor features advanced implementation of the quad Arm? Cortex?-A9 core, which operates at speeds up to 800 MHz. The MCIMX6D7CVT08AD applications processor combines scalable platforms with broad levels of integration and power-efficient processing capabilities particularly suited to multimedia applications.
Enhanced capabilities of high-tier portable applications by fulfilling MIPS needs of operations systems and games
Multilevel memory system
Smart speed technology that enables the designer to deliver a feature-rich product, requiring levels of power far lower than industry expectations
Dynamic voltage and frequency scaling
Powerful graphics acceleration
Interface flexibility
Integrated power management throughout the device
Advanced hardware-enabled security
Heating Ventilation, and Air Conditioning (HVAC)
Instrument Cluster
Brushless DC Motor (BLDC) Control
Electricity Generation
Heat Metering