Parameters |
Factory Lead Time |
1 Week |
Package / Case |
569-LFBGA |
Operating Temperature |
-40°C~105°C TA |
Packaging |
Tray |
Published |
2002 |
Series |
i.MX6D |
Part Status |
Active |
Moisture Sensitivity Level (MSL) |
3 (168 Hours) |
HTS Code |
8542.39.00.01 |
Peak Reflow Temperature (Cel) |
260 |
Time@Peak Reflow Temperature-Max (s) |
40 |
Speed |
800MHz |
Core Processor |
ARM® Cortex®-A9 |
Voltage - I/O |
1.8V 2.5V 2.8V 3.3V |
Ethernet |
10/100/1000Mbps (1) |
Number of Cores/Bus Width |
2 Core 32-Bit |
Graphics Acceleration |
Yes |
RAM Controllers |
LPDDR2, LVDDR3, DDR3 |
USB |
USB 2.0 + PHY (4) |
Additional Interfaces |
CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART |
Co-Processors/DSP |
Multimedia; NEON™ SIMD |
Security Features |
ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection |
Display & Interface Controllers |
Keypad, LCD |
SATA |
SATA 3Gbps (1) |
RoHS Status |
ROHS3 Compliant |
MCIMX6D7CZK08AE Overview
The microprocessor is conveniently packaged in 569-LFBGA, making it easy to ship internationally. High reliability is achieved by using advanced packaging methods Tray. Cores/Bus width of the CPU is 2 Core 32-Bit . Extended operating temperature around -40°C~105°C TA. This is part of the i.MX6D series. ARM? Cortex?-A9 is the processor core of this CPU. This CPU uses LPDDR2, LVDDR3, DDR3 RAM controllers. This microprocessor is equipped with an interface of CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART. I/O is run at 1.8V 2.5V 2.8V 3.3V on this CPU.
MCIMX6D7CZK08AE Features
ARM? Cortex?-A9 Core
MCIMX6D7CZK08AE Applications
There are a lot of NXP USA Inc. MCIMX6D7CZK08AE Microprocessor applications.
- Fire detection & safety devices
- Temperature sensing and controlling devices
- Pacemakers (used to control abnormal heart rhythm)
- Printers
- Traditional industrial transformation
- Measuring revolving objects
- Home video and audio
- ECG machine
- Computed Tomography (CT scan)
- Industrial robot