Parameters |
Factory Lead Time |
1 Week |
Package / Case |
624-FBGA, FCBGA |
Supplier Device Package |
624-FCBGA (21x21) |
Operating Temperature |
-40°C~125°C TJ |
Packaging |
Tape & Reel (TR) |
Published |
2002 |
Series |
i.MX6DP |
Part Status |
Active |
Moisture Sensitivity Level (MSL) |
3 (168 Hours) |
Speed |
1.0GHz |
Core Processor |
ARM® Cortex®-A9 |
Voltage - I/O |
1.8V 2.5V 2.8V 3.3V |
Ethernet |
10/100/1000Mbps (1) |
Number of Cores/Bus Width |
2 Core 32-Bit |
Graphics Acceleration |
Yes |
RAM Controllers |
LPDDR2, DDR3L, DDR3 |
USB |
USB 2.0 + PHY (3), USB 2.0 OTG + PHY (1) |
Additional Interfaces |
CAN, EBI/EMI, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, S/PDIF, UART |
Co-Processors/DSP |
Multimedia; NEON™ SIMD |
Security Features |
ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS |
Display & Interface Controllers |
HDMI, Keypad, LCD, LVDS, MIPI/DSI, Parallel |
SATA |
SATA 3Gbps (1) |
RoHS Status |
ROHS3 Compliant |
MCIMX6DP4AVT1ABR Overview
Packed in 624-FBGA, FCBGA, the microprocessor is convenient for shipping overseas. High reliability is provided by the advanced packaging method Tape & Reel (TR). There are 2 Core 32-Bit cores per bus width on the CPU. K-40°C~125°C TJw what the operating temperature is around -40°C~125°C TJ. A i.MX6DP series item. A ARM? Cortex?-A9 processor is present in this CPU. A CPU with this architecture uses LPDDR2, DDR3L, DDR3 RAM controllers. Microprocessors with CAN, EBI/EMI, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, S/PDIF, UART interfaces are designed to serve users better. The CPU runs I/O at 1.8V 2.5V 2.8V 3.3V. A supplier offers a 624-FCBGA (21x21) package.
MCIMX6DP4AVT1ABR Features
ARM? Cortex?-A9 Core
MCIMX6DP4AVT1ABR Applications
There are a lot of NXP USA Inc. MCIMX6DP4AVT1ABR Microprocessor applications.
- Radio
- Security systems
- Process control devices
- Fire alarms
- Playstation
- Dialysis machines (performs function of liver)
- Fabric
- Printers
- Automatic staplers
- Smartphone