Parameters |
Factory Lead Time |
1 Week |
Package / Case |
624-FBGA, FCBGA |
Operating Temperature |
-20°C~105°C TJ |
Packaging |
Tray |
Series |
i.MX6DP |
Part Status |
Active |
Moisture Sensitivity Level (MSL) |
3 (168 Hours) |
HTS Code |
8542.39.00.01 |
Speed |
1.2GHz |
Core Processor |
ARM® Cortex®-A9 |
Voltage - I/O |
1.8V 2.5V 2.8V 3.3V |
Ethernet |
10/100/1000Mbps (1) |
Number of Cores/Bus Width |
2 Core 32-Bit |
Graphics Acceleration |
Yes |
RAM Controllers |
LPDDR2, DDR3L, DDR3 |
USB |
USB 2.0 + PHY (3), USB 2.0 OTG + PHY (1) |
Additional Interfaces |
CAN, EBI/EMI, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, S/PDIF, UART |
Co-Processors/DSP |
Multimedia; NEON™ SIMD |
Security Features |
ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS |
Display & Interface Controllers |
HDMI, Keypad, LCD, LVDS, MIPI/DSI, Parallel |
SATA |
SATA 3Gbps (1) |
MCIMX6DP5EVT2AB Overview
Shipping overseas is convenient since the embedded microprocessor is packed in 624-FBGA, FCBGA. High reliability is achieved using advanced packaging method Tray. Cores/Bus width is 2 Core 32-Bit. Obtain a basic understanding of operating temperature around 0°C. The cpu microprocessor belongs to the i.MX6DP series. With a core count of ARM? Cortex?-A9, this CPU is multicore. There are LPDDR2, DDR3L, DDR3 RAM controllers used by this CPU. This microprocessor features CAN, EBI/EMI, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, S/PDIF, UART interfaces to better serve its users. 1.8V 2.5V 2.8V 3.3V is the I/O speed of this CPU.
MCIMX6DP5EVT2AB Features
ARM? Cortex?-A9 Core
MCIMX6DP5EVT2AB Applications
There are a lot of NXP USA Inc. MCIMX6DP5EVT2AB Microprocessor applications.
- Electronic jamming systems
- Laminators
- Measurement and control field
- Electrocardiogram (EKG)
- Hearing aids
- Television
- Binding machines
- Christmas lights
- Telephone sets
- PDAs, game consoles