Parameters |
Number of Cores/Bus Width |
2 Core 32-Bit |
Graphics Acceleration |
Yes |
RAM Controllers |
LPDDR2, DDR3L, DDR3 |
USB |
USB 2.0 + PHY (3), USB 2.0 OTG + PHY (1) |
Additional Interfaces |
CAN, EBI/EMI, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, S/PDIF, UART |
Co-Processors/DSP |
Multimedia; NEON™ SIMD |
Security Features |
ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS |
Display & Interface Controllers |
HDMI, Keypad, LCD, LVDS, MIPI/DSI, Parallel |
SATA |
SATA 3Gbps (1) |
RoHS Status |
ROHS3 Compliant |
Factory Lead Time |
1 Week |
Package / Case |
624-FBGA, FCBGA |
Supplier Device Package |
624-FCBGA (21x21) |
Operating Temperature |
-40°C~125°C TJ |
Packaging |
Tape & Reel (TR) |
Published |
2002 |
Series |
i.MX6DP |
Part Status |
Active |
Moisture Sensitivity Level (MSL) |
3 (168 Hours) |
Speed |
852MHz |
Core Processor |
ARM® Cortex®-A9 |
Voltage - I/O |
1.8V 2.5V 2.8V 3.3V |
Ethernet |
10/100/1000Mbps (1) |
MCIMX6DP6AVT8ABR Overview
Shipping overseas is convenient since the embedded microprocessor is packed in 624-FBGA, FCBGA. The packaging method Tape & Reel (TR) provides high reliability. There are 2 Core 32-Bit cores/bus width on the CPU. Recognize operating temperatures around -40°C~125°C TJ. From the i.MX6DP series. With a core count of ARM? Cortex?-A9, this CPU is multicore. This CPU uses LPDDR2, DDR3L, DDR3 RAM controllers. The microprocessor features interfaces CAN, EBI/EMI, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, S/PDIF, UART for better service. There is 1.8V 2.5V 2.8V 3.3V I/O running on this CPU. Suppliers offer 624-FCBGA (21x21) packages.
MCIMX6DP6AVT8ABR Features
ARM? Cortex?-A9 Core
MCIMX6DP6AVT8ABR Applications
There are a lot of NXP USA Inc. MCIMX6DP6AVT8ABR Microprocessor applications.
- Torpedo guidance
- Kindle
- Broadband technology, video and voice processing
- Medical instruments chromatographs
- Fire alarms
- Embedded gateways
- Telephone sets
- Industrial instrumentation devices
- Projectors
- Dishwashers