MCIMX6DP7CVT8AB
| Parameters | |
|---|---|
| Supply Voltage-Min (Vsup) | 1.275V |
| Number of I/O | 14 |
| Speed | 800MHz |
| Core Processor | ARM® Cortex®-A9 |
| Address Bus Width | 26 |
| Boundary Scan | YES |
| External Data Bus Width | 16 |
| RAM (words) | 512000 |
| Voltage - I/O | 1.8V 2.5V 2.8V 3.3V |
| Ethernet | 10/100/1000Mbps (1) |
| Number of Cores/Bus Width | 2 Core 32-Bit |
| Graphics Acceleration | Yes |
| RAM Controllers | LPDDR2, DDR3L, DDR3 |
| USB | USB 2.0 + PHY (3), USB 2.0 OTG + PHY (1) |
| Additional Interfaces | CAN, EBI/EMI, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, S/PDIF, UART |
| Co-Processors/DSP | Multimedia; NEON™ SIMD |
| Bus Compatibility | CAN; ETHERNET; I2C; I2S; IRDA; PCI; RS-232; RS-485; SPI; UART; USB |
| Security Features | ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS |
| Display & Interface Controllers | HDMI, Keypad, LCD, LVDS, MIPI/DSI, Parallel |
| SATA | SATA 3Gbps (1) |
| Height Seated (Max) | 2.16mm |
| Length | 21mm |
| RoHS Status | ROHS3 Compliant |
| Factory Lead Time | 1 Week |
| Package / Case | 624-FBGA, FCBGA |
| Surface Mount | YES |
| Operating Temperature | -40°C~105°C TA |
| Packaging | Tray |
| Published | 2002 |
| Series | i.MX6DP |
| JESD-609 Code | e1 |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Number of Terminations | 624 |
| ECCN Code | 5A992 |
| Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) |
| HTS Code | 8542.39.00.01 |
| Technology | CMOS |
| Terminal Position | BOTTOM |
| Terminal Form | BALL |
| Peak Reflow Temperature (Cel) | 260 |
| Terminal Pitch | 0.8mm |
| Time@Peak Reflow Temperature-Max (s) | 40 |
| JESD-30 Code | S-PBGA-B624 |
| Supply Voltage-Max (Vsup) | 1.5V |
MCIMX6DP7CVT8AB Overview
Shipping overseas is convenient since the embedded microprocessor is packed in 624-FBGA, FCBGA. High reliability can be achieved by using the advanced packaging method Tray. Cores/Bus width is 2 Core 32-Bit. K-40°C~105°C TAw what the operating temperature is around -40°C~105°C TA. This is a member of the i.MX6DP series. With a core count of ARM? Cortex?-A9, this CPU is multicore. The CPU uses LPDDR2, DDR3L, DDR3 RAM controllers. A CAN, EBI/EMI, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, S/PDIF, UART interface has been added to this microprocessor in order to serve the user better. In this CPU, I/O is set to 1.8V 2.5V 2.8V 3.3V. In total, there are 624 terminations. The maximum supply current of this microprocessor is 1.5V. Its external data bus width is 16. A CPU program transfers data by using 14 I/Os.
MCIMX6DP7CVT8AB Features
ARM? Cortex?-A9 Core
14 I/Os
MCIMX6DP7CVT8AB Applications
There are a lot of NXP USA Inc. MCIMX6DP7CVT8AB Microprocessor applications.
- Answering machines
- Printers
- Electromechanical control
- Network application field
- Paper shredders
- Fabric
- Microwave ovens
- Industrial control field
- Industrial instrumentation devices
- Hard drives
