Parameters | |
---|---|
Factory Lead Time | 1 Week |
Package / Case | 289-LFBGA |
Surface Mount | YES |
Operating Temperature | -40°C~105°C TJ |
Packaging | Tray |
Published | 2012 |
Series | i.MX6UL |
JESD-609 Code | e2 |
Part Status | Obsolete |
Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
Number of Terminations | 289 |
ECCN Code | 5A992 |
Terminal Finish | Tin/Silver (Sn/Ag) |
HTS Code | 8542.31.00.01 |
Technology | CMOS |
Terminal Position | BOTTOM |
Terminal Form | BALL |
Peak Reflow Temperature (Cel) | 260 |
Terminal Pitch | 0.8mm |
Time@Peak Reflow Temperature-Max (s) | 40 |
JESD-30 Code | S-PBGA-B289 |
Supply Voltage-Max (Vsup) | 1.3V |
Supply Voltage-Min (Vsup) | 1.15V |
Speed | 528MHz |
uPs/uCs/Peripheral ICs Type | MICROPROCESSOR |
Core Processor | ARM® Cortex®-A7 |
Address Bus Width | 16 |
Boundary Scan | YES |
Low Power Mode | YES |
External Data Bus Width | 16 |
Format | FIXED POINT |
Integrated Cache | YES |
Voltage - I/O | 1.2V 1.35V 1.5V 1.8V 2.5V 2.8V 3.3V |
Ethernet | 10/100Mbps (1) |
Number of Cores/Bus Width | 1 Core 32-Bit |
Graphics Acceleration | No |
RAM Controllers | LPDDR2, DDR3, DDR3L |
USB | USB 2.0 + PHY (2) |
Additional Interfaces | CAN, EBI/EMI, I2C, I2S, MMC/SD/SDIO, QSPI, SAI, SPI, SSI, S/PDIF, UART |
Co-Processors/DSP | Multimedia; NEON™ SIMD |
Security Features | ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS |
Display & Interface Controllers | LVDS |
Height Seated (Max) | 1.32mm |
Length | 14mm |
RoHS Status | ROHS3 Compliant |
The i.MX 6UltraLite is a high-performance, ultra-efficient processor family featuring NXP's advanced implementation of the single ARM Cortex?-A7 core,
which operates at speeds up to 528 MHz. The i.MX 6UltraLite includes an integrated power management module that reduces the complexity of the external power supply and simplifies the power sequencing. Each processor in this family provides various memory interfaces, including LPDDR2, DDR3, DDR3L, Raw and Managed NAND flash, NOR flash, eMMC, Quad SPI, and a wide range of other interfaces for connecting peripherals, such as WLAN, Bluetooth?, GPS, displays, and camera sensors.
Single-core ARM Cortex-A7—The single-core A7 provides a cost-effective and power-efficient
solution.
Multilevel memory system—The multilevel memory system of each device is based on the L1
instruction and data caches, L2 cache, and internal and external memory. The device supports
many types of external memory devices, including DDR3, low voltage DDR3, LPDDR2, NOR
Flash, NAND Flash (MLC and SLC), OneNAND?, Quad SPI, and managed NAND, including
eMMC up to rev 4.4/4.41/4.5.
Smart speed technology—Power management implemented throughout the IC that enables
multimedia features and peripherals to consume minimum power in both active and various low
power modes.
Dynamic voltage and frequency scaling—The processor improves the power efficiency by scaling
the voltage and frequency to optimize performance.
Multimedia powerhouse—Multimedia performance is enhanced by a multilevel cache system,
NEON? MPE (Media Processor Engine) co-processor, a programmable smart DMA (SDMA)
controller, an asynchronous audio sample rate converter, and a Pixel processing pipeline (PXP) to
support 2D image processing, including color-space conversion, scaling, alpha-blending, and
rotation.
Electronics Point-of-Sale device
Telematics
IoT Gateway
Access control panels
Human Machine Interfaces (HMI)
Smart appliances