MCIMX6L3EVN10AA
| Parameters | |
|---|---|
| Package / Case | 432-TFBGA |
| Supplier Device Package | 432-MAPBGA (13x13) |
| Operating Temperature | -40°C~105°C TA |
| Packaging | Tray |
| Series | i.MX6SL |
| Part Status | Obsolete |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Speed | 1.0GHz |
| Core Processor | ARM® Cortex®-A9 |
| Voltage - I/O | 1.2V 1.8V 3.0V |
| Ethernet | 10/100Mbps (1) |
| Number of Cores/Bus Width | 1 Core 32-Bit |
| Graphics Acceleration | Yes |
| RAM Controllers | LPDDR2, LVDDR3, DDR3 |
| USB | USB 2.0 + PHY (3) |
| Additional Interfaces | AC97, I2C, I2S, MMC/SD/SDIO, SPI, SSI, UART |
| Co-Processors/DSP | Multimedia; NEON™ SIMD |
| Security Features | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection |
| Display & Interface Controllers | Keypad, LCD |
| RoHS Status | ROHS3 Compliant |
MCIMX6L3EVN10AA Overview
The embedded microprocessor has been packed in 432-TFBGA for convenient overseas shipping. High reliability is achieved using advanced packaging method Tray. This CPU has 1 Core 32-Bit cores and 1 Core 32-Bit bus widths. Be aware of the operating temperature around -40°C~105°C TA. It comes from the i.MX6SL series. This CPU is cored with a ARM? Cortex?-A9 processor. A CPU with this architecture uses LPDDR2, LVDDR3, DDR3 RAM controllers. With its AC97, I2C, I2S, MMC/SD/SDIO, SPI, SSI, UART interfaces, this microprocessor will be able to serve you better. There is 1.2V 1.8V 3.0V I/O running on this CPU. There is a 432-MAPBGA (13x13) package offered by suppliers.
MCIMX6L3EVN10AA Features
ARM? Cortex?-A9 Core
MCIMX6L3EVN10AA Applications
There are a lot of Rochester Electronics, LLC MCIMX6L3EVN10AA Microprocessor applications.
- Network application field
- Smartphone
- Mobile computers
- Keyboards
- Paper shredders
- Projectors
- Microwave ovens
- Network communication, mobile communication field
- Industrial control field
- Digital set-top boxes
