Parameters |
Package / Case |
432-TFBGA |
Supplier Device Package |
432-MAPBGA (13x13) |
Operating Temperature |
0°C~95°C TJ |
Packaging |
Tray |
Series |
i.MX6SL |
Part Status |
Obsolete |
Moisture Sensitivity Level (MSL) |
3 (168 Hours) |
Speed |
1.0GHz |
Core Processor |
ARM® Cortex®-A9 |
Voltage - I/O |
1.2V 1.8V 3.0V |
Ethernet |
10/100Mbps (1) |
Number of Cores/Bus Width |
1 Core 32-Bit |
Graphics Acceleration |
Yes |
RAM Controllers |
LPDDR2, LVDDR3, DDR3 |
USB |
USB 2.0 + PHY (3) |
Additional Interfaces |
AC97, I2C, I2S, MMC/SD/SDIO, SPI, SSI, UART |
Co-Processors/DSP |
Multimedia; NEON™ SIMD |
Security Features |
ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection |
Display & Interface Controllers |
Keypad, LCD |
RoHS Status |
ROHS3 Compliant |
MCIMX6L7DVN10AA Overview
With a packing size of 432-TFBGA, this embedded microprocessor is ideal for international shipping. In order to provide high reliability, advanced packaging method Tray is used. This CPU has 1 Core 32-Bit cores and 1 Core 32-Bit bus widths. The operating temperature around 0°C~95°C TJ should be understood. This is a member of the i.MX6SL series. A ARM? Cortex?-A9 processor is present in this CPU. It has LPDDR2, LVDDR3, DDR3 RAM controllers. This microprocessor features AC97, I2C, I2S, MMC/SD/SDIO, SPI, SSI, UART interfaces to better serve its users. There is 1.2V 1.8V 3.0V I/O running on this CPU. Suppliers offer the 432-MAPBGA (13x13) package.
MCIMX6L7DVN10AA Features
ARM? Cortex?-A9 Core
MCIMX6L7DVN10AA Applications
There are a lot of Rochester Electronics, LLC MCIMX6L7DVN10AA Microprocessor applications.
- Network application field
- Graphic terminals
- Data acquisition and control
- Projector
- Dishwashers
- Entertainment products
- Microwave ovens
- Electrocardiogram (EKG)
- Microwave ovens
- Coffee machines