MCIMX6L8DVN10ACR
| Parameters | |
|---|---|
| Factory Lead Time | 1 Week |
| Package / Case | 432-TFBGA |
| Operating Temperature | 0°C~95°C TJ |
| Packaging | Tape & Reel (TR) |
| Series | i.MX6SL |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
| Speed | 1.0GHz |
| Core Processor | ARM® Cortex®-A9 |
| Voltage - I/O | 1.2V 1.8V 3.0V |
| Ethernet | 10/100Mbps (1) |
| Number of Cores/Bus Width | 1 Core 32-Bit |
| Graphics Acceleration | Yes |
| RAM Controllers | LPDDR2, LVDDR3, DDR3 |
| USB | USB 2.0 + PHY (3) |
| Additional Interfaces | AC97, I2C, I2S, MMC/SD/SDIO, SPI, SSI, UART |
| Co-Processors/DSP | Multimedia; NEON™ SIMD |
| Security Features | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection |
| Display & Interface Controllers | Keypad, LCD |
| RoHS Status | ROHS3 Compliant |
MCIMX6L8DVN10ACR Overview
Packed in 432-TFBGA, the microprocessor is convenient for shipping overseas. High reliability is achieved with advanced packaging method Tape & Reel (TR). Cores/Bus width of the CPU is 1 Core 32-Bit . Extended operating temperature around 0°C~95°C TJ. In the series i.MX6SL, it is found. With a core count of ARM? Cortex?-A9, this CPU is multicore. There are LPDDR2, LVDDR3, DDR3 RAM controllers on this CPU. A AC97, I2C, I2S, MMC/SD/SDIO, SPI, SSI, UART interface has been added to this microprocessor in order to serve the user better. In this CPU, I/O is set to 1.2V 1.8V 3.0V.
MCIMX6L8DVN10ACR Features
ARM? Cortex?-A9 Core
MCIMX6L8DVN10ACR Applications
There are a lot of NXP USA Inc. MCIMX6L8DVN10ACR Microprocessor applications.
- Firewalls
- 3D printers
- Petrochemical
- Digital set-top boxes
- Medical instruments
- Accu-check
- Fire alarms
- Embedded gateways
- Laminators
- Smart highways (navigation, traffic control, information monitoring and car service)
