Parameters |
Package / Case |
624-LFBGA, FCBGA |
Surface Mount |
YES |
Operating Temperature |
-20°C~105°C TJ |
Packaging |
Tray |
Published |
2002 |
Series |
i.MX6Q |
JESD-609 Code |
e1 |
Part Status |
Not For New Designs |
Moisture Sensitivity Level (MSL) |
3 (168 Hours) |
Number of Terminations |
624 |
ECCN Code |
5A992 |
Terminal Finish |
Tin/Silver/Copper (Sn/Ag/Cu) |
HTS Code |
8542.31.00.01 |
Technology |
CMOS |
Terminal Position |
BOTTOM |
Terminal Form |
BALL |
Peak Reflow Temperature (Cel) |
260 |
Terminal Pitch |
0.8mm |
Time@Peak Reflow Temperature-Max (s) |
40 |
Base Part Number |
MCIMX6 |
JESD-30 Code |
S-PBGA-B624 |
Supply Voltage-Max (Vsup) |
1.5V |
Supply Voltage-Min (Vsup) |
1.35V |
Speed |
1.0GHz |
uPs/uCs/Peripheral ICs Type |
MICROPROCESSOR |
Core Processor |
ARM® Cortex®-A9 |
Clock Frequency |
24MHz |
Bit Size |
64 |
Address Bus Width |
16 |
Boundary Scan |
YES |
Low Power Mode |
YES |
External Data Bus Width |
64 |
Format |
FIXED POINT |
Integrated Cache |
YES |
Voltage - I/O |
1.8V 2.5V 2.8V 3.3V |
Ethernet |
10/100/1000Mbps (1) |
Number of Cores/Bus Width |
4 Core 32-Bit |
Graphics Acceleration |
Yes |
RAM Controllers |
LPDDR2, LVDDR3, DDR3 |
USB |
USB 2.0 + PHY (4) |
Additional Interfaces |
CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART |
Co-Processors/DSP |
Multimedia; NEON™ SIMD |
Security Features |
ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection |
Display & Interface Controllers |
Keypad, LCD |
SATA |
SATA 3Gbps (1) |
Height Seated (Max) |
1.6mm |
Length |
21mm |
RoHS Status |
ROHS3 Compliant |