Parameters |
Factory Lead Time |
1 Week |
Package / Case |
624-LFBGA, FCBGA |
Operating Temperature |
-20°C~105°C TJ |
Packaging |
Tape & Reel (TR) |
Published |
2002 |
Series |
i.MX6Q |
Part Status |
Active |
Moisture Sensitivity Level (MSL) |
3 (168 Hours) |
Peak Reflow Temperature (Cel) |
260 |
Time@Peak Reflow Temperature-Max (s) |
40 |
Speed |
1.0GHz |
Core Processor |
ARM® Cortex®-A9 |
Voltage - I/O |
1.8V 2.5V 2.8V 3.3V |
Ethernet |
10/100/1000Mbps (1) |
Number of Cores/Bus Width |
4 Core 32-Bit |
Graphics Acceleration |
Yes |
RAM Controllers |
LPDDR2, LVDDR3, DDR3 |
USB |
USB 2.0 + PHY (4) |
Additional Interfaces |
CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART |
Co-Processors/DSP |
Multimedia; NEON™ SIMD |
Security Features |
ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection |
Display & Interface Controllers |
Keypad, LCD |
SATA |
SATA 3Gbps (1) |
RoHS Status |
ROHS3 Compliant |
MCIMX6Q5EYM10AER Overview
With a packing size of 624-LFBGA, FCBGA, this embedded microprocessor is ideal for international shipping. Using advanced packaging techniques Tape & Reel (TR), high reliability is ensured. There are 4 Core 32-Bit cores per bus width on the CPU. Understand the operating temperature around -20°C~105°C TJ. In the series i.MX6Q, it is found. A ARM? Cortex?-A9 processor is present in this CPU. A total of LPDDR2, LVDDR3, DDR3 RAM controllers are used by this CPU. To serve better this microprocessor features CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART interfaces. 1.8V 2.5V 2.8V 3.3V is the CPU's I/O address.
MCIMX6Q5EYM10AER Features
ARM? Cortex?-A9 Core
MCIMX6Q5EYM10AER Applications
There are a lot of NXP USA Inc. MCIMX6Q5EYM10AER Microprocessor applications.
- Nintendo
- Smart instruments
- Tape drives
- Ipod
- Removable disks
- Safety -airbags, automatic braking system (ABS)
- Entertainment-radios, CD players, televisions
- ECG machine
- 3D printers
- Safety field