Parameters |
Factory Lead Time |
1 Week |
Package / Case |
569-LFBGA |
Operating Temperature |
-20°C~105°C TJ |
Packaging |
Tray |
Series |
i.MX6Q |
Part Status |
Active |
Moisture Sensitivity Level (MSL) |
3 (168 Hours) |
HTS Code |
8542.39.00.01 |
Peak Reflow Temperature (Cel) |
260 |
Time@Peak Reflow Temperature-Max (s) |
40 |
Speed |
800MHz |
Core Processor |
ARM® Cortex®-A9 |
Voltage - I/O |
1.8V 2.5V 2.8V 3.3V |
Ethernet |
10/100/1000Mbps (1) |
Number of Cores/Bus Width |
4 Core 32-Bit |
Graphics Acceleration |
Yes |
RAM Controllers |
LPDDR2, LVDDR3, DDR3 |
USB |
USB 2.0 + PHY (4) |
Additional Interfaces |
CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART |
Co-Processors/DSP |
Multimedia; NEON™ SIMD |
Security Features |
ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection |
Display & Interface Controllers |
Keypad, LCD |
SATA |
SATA 3Gbps (1) |
RoHS Status |
ROHS3 Compliant |
MCIMX6Q5EZK08AE Overview
Shipping overseas is convenient thanks to the embedded microprocessor's packaging in 569-LFBGA. In order to provide high reliability, advanced packaging method Tray is used. Cores/Bus width of the CPU is 4 Core 32-Bit . Recognize operating temperatures around -20°C~105°C TJ. The i.MX6Q series contains it. A ARM? Cortex?-A9 processor is present in this CPU. The CPU contains LPDDR2, LVDDR3, DDR3 RAM controllers. This microprocessor has CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART interfaces to serve you better. 1.8V 2.5V 2.8V 3.3V is the I/O speed of this CPU.
MCIMX6Q5EZK08AE Features
ARM? Cortex?-A9 Core
MCIMX6Q5EZK08AE Applications
There are a lot of NXP USA Inc. MCIMX6Q5EZK08AE Microprocessor applications.
- Hand-held metering systems
- Office automation equipment and computer peripherals
- Toasters
- Current meter
- Fire detection & safety devices
- Industrial instrumentation devices
- Fax machines
- Embedded gateways
- 8. Navigation control field
- Multi-meter