MCIMX6Q6AVT10AE
| Parameters | |
|---|---|
| Factory Lead Time | 1 Week |
| Package / Case | 624-FBGA, FCBGA |
| Operating Temperature | -40°C~125°C TJ |
| Packaging | Tray |
| Published | 2002 |
| Series | i.MX6Q |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Peak Reflow Temperature (Cel) | 260 |
| Time@Peak Reflow Temperature-Max (s) | 40 |
| Speed | 1.0GHz |
| Core Processor | ARM® Cortex®-A9 |
| Voltage - I/O | 1.8V 2.5V 2.8V 3.3V |
| Ethernet | 10/100/1000Mbps (1) |
| Number of Cores/Bus Width | 4 Core 32-Bit |
| Graphics Acceleration | Yes |
| RAM Controllers | LPDDR2, LVDDR3, DDR3 |
| USB | USB 2.0 + PHY (4) |
| Additional Interfaces | CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART |
| Co-Processors/DSP | Multimedia; NEON™ SIMD |
| Security Features | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection |
| Display & Interface Controllers | Keypad, LCD |
| SATA | SATA 3Gbps (1) |
| RoHS Status | ROHS3 Compliant |
MCIMX6Q6AVT10AE Overview
Packed in 624-FBGA, FCBGA, the microprocessor is convenient for shipping overseas. The packaging method Tray provides high reliability. CPUs have 4 Core 32-Bit cores/bus width. Obtain a basic understanding of operating temperature around 0°C. In the i.MX6Q series, it is found. A ARM? Cortex?-A9 processor is present in this CPU. LPDDR2, LVDDR3, DDR3 RAM controllers are used by this CPU. Microprocessors with CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART interfaces are designed to serve users better. At 1.8V 2.5V 2.8V 3.3V, the CPU runs its I/O.
MCIMX6Q6AVT10AE Features
ARM? Cortex?-A9 Core
MCIMX6Q6AVT10AE Applications
There are a lot of NXP USA Inc. MCIMX6Q6AVT10AE Microprocessor applications.
- Process control devices
- 8. Navigation control field
- Toasters
- Microwave ovens
- Fax machines
- Torpedo guidance
- Network application field
- DVD\DV\MP3 players
- Embedded gateways
- Fire detection & safety devices
