Parameters |
Factory Lead Time |
1 Week |
Package / Case |
624-FBGA, FCBGA |
Operating Temperature |
-20°C~105°C TJ |
Packaging |
Tray |
Series |
i.MX6QP |
Part Status |
Active |
Moisture Sensitivity Level (MSL) |
3 (168 Hours) |
HTS Code |
8542.39.00.01 |
Peak Reflow Temperature (Cel) |
260 |
Time@Peak Reflow Temperature-Max (s) |
40 |
Speed |
1.2GHz |
Core Processor |
ARM® Cortex®-A9 |
Voltage - I/O |
1.8V 2.5V 2.8V 3.3V |
Ethernet |
10/100/1000Mbps (1) |
Number of Cores/Bus Width |
4 Core 32-Bit |
Graphics Acceleration |
Yes |
RAM Controllers |
LPDDR2, DDR3L, DDR3 |
USB |
USB 2.0 + PHY (3), USB 2.0 OTG + PHY (1) |
Additional Interfaces |
CAN, EBI/EMI, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, S/PDIF, UART |
Co-Processors/DSP |
Multimedia; NEON™ SIMD |
Security Features |
ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS |
Display & Interface Controllers |
HDMI, Keypad, LCD, LVDS, MIPI/DSI, Parallel |
SATA |
SATA 3Gbps (1) |
RoHS Status |
ROHS3 Compliant |
MCIMX6QP5EVT2AB Overview
Shipping overseas is convenient since the embedded microprocessor is packed in 624-FBGA, FCBGA. A high level of reliability is provided by using an advanced packaging method Tray. This CPU has 4 Core 32-Bit cores and 4 Core 32-Bit bus widths. K-20°C~105°C TJw what the operating temperature is around -20°C~105°C TJ. From the i.MX6QP series. Core-wise, this CPU has a ARM? Cortex?-A9 processor. LPDDR2, DDR3L, DDR3 RAM controllers are used by this CPU. A CAN, EBI/EMI, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, S/PDIF, UART interface has been added to this microprocessor in order to serve the user better. The CPU runs I/O at 1.8V 2.5V 2.8V 3.3V.
MCIMX6QP5EVT2AB Features
ARM? Cortex?-A9 Core
MCIMX6QP5EVT2AB Applications
There are a lot of NXP USA Inc. MCIMX6QP5EVT2AB Microprocessor applications.
- Traditional industrial transformation
- Ipod
- Information appliances (networking of household appliances)
- Fax machines
- Auto-breaking system
- Light sensing & controlling devices
- Binding machines
- Radio
- Robots
- Instrument control