Parameters |
Factory Lead Time |
1 Week |
Package / Case |
624-FBGA, FCBGA |
Operating Temperature |
-40°C~105°C TA |
Packaging |
Tray |
Published |
2002 |
Series |
i.MX6QP |
Part Status |
Active |
Moisture Sensitivity Level (MSL) |
3 (168 Hours) |
HTS Code |
8542.39.00.01 |
Peak Reflow Temperature (Cel) |
260 |
Time@Peak Reflow Temperature-Max (s) |
40 |
Speed |
800MHz |
Core Processor |
ARM® Cortex®-A9 |
Voltage - I/O |
1.8V 2.5V 2.8V 3.3V |
Ethernet |
10/100/1000Mbps (1) |
Number of Cores/Bus Width |
4 Core 32-Bit |
Graphics Acceleration |
Yes |
RAM Controllers |
LPDDR2, DDR3L, DDR3 |
USB |
USB 2.0 + PHY (3), USB 2.0 OTG + PHY (1) |
Additional Interfaces |
CAN, EBI/EMI, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, S/PDIF, UART |
Co-Processors/DSP |
Multimedia; NEON™ SIMD |
Security Features |
ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS |
Display & Interface Controllers |
HDMI, Keypad, LCD, LVDS, MIPI/DSI, Parallel |
SATA |
SATA 3Gbps (1) |
RoHS Status |
ROHS3 Compliant |
MCIMX6QP7CVT8AB Overview
Due to its 624-FBGA, FCBGA packaging, it is convenient to ship overseas. Advanced packaging method Tray is used to provide high reliability. Cores/Bus width of the CPU is 4 Core 32-Bit . Recognize operating temperatures around -40°C~105°C TA. In the series i.MX6QP, it is found. A ARM? Cortex?-A9 processor is present in this CPU. The CPU contains LPDDR2, DDR3L, DDR3 RAM controllers. This microprocessor is equipped with an interface of CAN, EBI/EMI, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, S/PDIF, UART. The CPU runs I/O at 1.8V 2.5V 2.8V 3.3V.
MCIMX6QP7CVT8AB Features
ARM? Cortex?-A9 Core
MCIMX6QP7CVT8AB Applications
There are a lot of NXP USA Inc. MCIMX6QP7CVT8AB Microprocessor applications.
- Agriculture, transportation field
- Home video and audio
- Television
- Paper shredders
- Plant factories (special plant factories, soilless cultivation technology, smart seed engineering)
- Hard drives
- Electrocardiogram (EKG)
- Data acquisition and control
- Coffee machines
- Dishwashers