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MCIMX6QP7CVT8AB

ARM? Cortex?-A9 Microprocessor i.MX6QP Series 624-FBGA, FCBGA


  • Manufacturer: NXP USA Inc.
  • Nocochips NO: 568-MCIMX6QP7CVT8AB
  • Package: 624-FBGA, FCBGA
  • Datasheet: PDF
  • Stock: 405
  • Description: ARM? Cortex?-A9 Microprocessor i.MX6QP Series 624-FBGA, FCBGA (Kg)

Details

Tags

Parameters
Factory Lead Time 1 Week
Package / Case 624-FBGA, FCBGA
Operating Temperature -40°C~105°C TA
Packaging Tray
Published 2002
Series i.MX6QP
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
HTS Code 8542.39.00.01
Peak Reflow Temperature (Cel) 260
Time@Peak Reflow Temperature-Max (s) 40
Speed 800MHz
Core Processor ARM® Cortex®-A9
Voltage - I/O 1.8V 2.5V 2.8V 3.3V
Ethernet 10/100/1000Mbps (1)
Number of Cores/Bus Width 4 Core 32-Bit
Graphics Acceleration Yes
RAM Controllers LPDDR2, DDR3L, DDR3
USB USB 2.0 + PHY (3), USB 2.0 OTG + PHY (1)
Additional Interfaces CAN, EBI/EMI, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, S/PDIF, UART
Co-Processors/DSP Multimedia; NEON™ SIMD
Security Features ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS
Display & Interface Controllers HDMI, Keypad, LCD, LVDS, MIPI/DSI, Parallel
SATA SATA 3Gbps (1)
RoHS Status ROHS3 Compliant

MCIMX6QP7CVT8AB Overview


Due to its 624-FBGA, FCBGA packaging, it is convenient to ship overseas. Advanced packaging method Tray is used to provide high reliability. Cores/Bus width of the CPU is 4 Core 32-Bit . Recognize operating temperatures around -40°C~105°C TA. In the series i.MX6QP, it is found. A ARM? Cortex?-A9 processor is present in this CPU. The CPU contains LPDDR2, DDR3L, DDR3 RAM controllers. This microprocessor is equipped with an interface of CAN, EBI/EMI, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, S/PDIF, UART. The CPU runs I/O at 1.8V 2.5V 2.8V 3.3V.

MCIMX6QP7CVT8AB Features


ARM? Cortex?-A9 Core

MCIMX6QP7CVT8AB Applications


There are a lot of NXP USA Inc. MCIMX6QP7CVT8AB Microprocessor applications.

  • Agriculture, transportation field
  • Home video and audio
  • Television
  • Paper shredders
  • Plant factories (special plant factories, soilless cultivation technology, smart seed engineering)
  • Hard drives
  • Electrocardiogram (EKG)
  • Data acquisition and control
  • Coffee machines
  • Dishwashers

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