Parameters |
Factory Lead Time |
1 Week |
Package / Case |
624-LFBGA |
Operating Temperature |
-40°C~125°C TJ |
Packaging |
Tape & Reel (TR) |
Published |
2002 |
Series |
i.MX6S |
Part Status |
Active |
Moisture Sensitivity Level (MSL) |
3 (168 Hours) |
Speed |
800MHz |
Core Processor |
ARM® Cortex®-A9 |
Voltage - I/O |
1.8V 2.5V 2.8V 3.3V |
Ethernet |
10/100/1000Mbps (1) |
Number of Cores/Bus Width |
1 Core 32-Bit |
Graphics Acceleration |
Yes |
RAM Controllers |
LPDDR2, LVDDR3, DDR3 |
USB |
USB 2.0 + PHY (4) |
Additional Interfaces |
CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART |
Co-Processors/DSP |
Multimedia; NEON™ SIMD |
Security Features |
ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection |
Display & Interface Controllers |
Keypad, LCD |
RoHS Status |
ROHS3 Compliant |
MCIMX6S1AVM08ACR Overview
Due to its 624-LFBGA packaging, it is convenient to ship overseas. High reliability is achieved using advanced packaging method Tape & Reel (TR). In the CPU, there are 1 Core 32-Bit cores and 1 Core 32-Bit bus width. Extended operating temperature around -40°C~125°C TJ. In the i.MX6S series, it is found. Core-wise, this CPU has a ARM? Cortex?-A9 processor. A total of LPDDR2, LVDDR3, DDR3 RAM controllers are used by this CPU. Microprocessors with CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART interfaces are designed to serve users better. I/O is run at 1.8V 2.5V 2.8V 3.3V on this CPU.
MCIMX6S1AVM08ACR Features
ARM? Cortex?-A9 Core
MCIMX6S1AVM08ACR Applications
There are a lot of NXP USA Inc. MCIMX6S1AVM08ACR Microprocessor applications.
- Refrigerators
- Aerospace navigation systems
- Toasters
- Scanners
- Fax machines
- X-ray
- Blenders
- Electromechanical control
- Magnetic resonance imaging (MRI)
- Washing machine