Parameters |
Factory Lead Time |
1 Week |
Package / Case |
624-LFBGA |
Operating Temperature |
-40°C~125°C TJ |
Packaging |
Tape & Reel (TR) |
Series |
i.MX6S |
Part Status |
Active |
Moisture Sensitivity Level (MSL) |
3 |
Peak Reflow Temperature (Cel) |
260 |
Time@Peak Reflow Temperature-Max (s) |
40 |
Speed |
800MHz |
Core Processor |
ARM® Cortex®-A9 |
Voltage - I/O |
1.8V 2.5V 2.8V 3.3V |
Ethernet |
10/100/1000Mbps (1) |
Number of Cores/Bus Width |
1 Core 32-Bit |
Graphics Acceleration |
Yes |
RAM Controllers |
LPDDR2, LVDDR3, DDR3 |
USB |
USB 2.0 + PHY (4) |
Additional Interfaces |
CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART |
Co-Processors/DSP |
Multimedia; NEON™ SIMD |
Security Features |
ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection |
Display & Interface Controllers |
Keypad, LCD |
RoHS Status |
ROHS3 Compliant |
MCIMX6S6AVM08ADR Overview
The microprocessor is convenient for international shipping since it is packaged in 624-LFBGA. High reliability is achieved using advanced packaging method Tape & Reel (TR). In the CPU, there are 1 Core 32-Bit cores and 1 Core 32-Bit bus width. Understand the operating temperature around -40°C~125°C TJ. This is part of the i.MX6S series. Core-wise, this CPU has a ARM? Cortex?-A9 processor. This CPU uses LPDDR2, LVDDR3, DDR3 RAM controllers. The microprocessor features interfaces CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART for better service. I/O is run at 1.8V 2.5V 2.8V 3.3V on this CPU.
MCIMX6S6AVM08ADR Features
ARM? Cortex?-A9 Core
MCIMX6S6AVM08ADR Applications
There are a lot of NXP USA Inc. MCIMX6S6AVM08ADR Microprocessor applications.
- Smartphone
- Set-top boxes
- Washing machine
- Hand-held metering systems
- Speed meter
- Industrial robot
- Medical instruments
- Sonography (Ultrasound imaging)
- Robots
- Instrumentation and process control field