Parameters | |
---|---|
Package / Case | 624-LFBGA |
Surface Mount | YES |
Operating Temperature | -40°C~105°C TA |
Packaging | Tray |
Published | 2002 |
Series | i.MX6DL |
JESD-609 Code | e1 |
Part Status | Not For New Designs |
Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
Number of Terminations | 624 |
ECCN Code | 5A992 |
Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) |
HTS Code | 8542.31.00.01 |
Technology | CMOS |
Terminal Position | BOTTOM |
Terminal Form | BALL |
Peak Reflow Temperature (Cel) | 260 |
Terminal Pitch | 0.8mm |
Time@Peak Reflow Temperature-Max (s) | 40 |
Base Part Number | MCIMX6 |
JESD-30 Code | S-PBGA-B624 |
Supply Voltage-Max (Vsup) | 1.5V |
Supply Voltage-Min (Vsup) | 1.275V |
Speed | 800MHz |
uPs/uCs/Peripheral ICs Type | MICROPROCESSOR, RISC |
Core Processor | ARM® Cortex®-A9 |
Bit Size | 32 |
Address Bus Width | 26 |
Boundary Scan | YES |
Low Power Mode | YES |
External Data Bus Width | 32 |
Format | FLOATING POINT |
Integrated Cache | YES |
Voltage - I/O | 1.8V 2.5V 2.8V 3.3V |
Ethernet | 10/100/1000Mbps (1) |
Number of Cores/Bus Width | 2 Core 32-Bit |
Graphics Acceleration | Yes |
RAM Controllers | LPDDR2, LVDDR3, DDR3 |
USB | USB 2.0 + PHY (4) |
Additional Interfaces | CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART |
Co-Processors/DSP | Multimedia; NEON™ SIMD |
Security Features | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection |
Display & Interface Controllers | Keypad, LCD |
Height Seated (Max) | 1.6mm |
Length | 21mm |
RoHS Status | ROHS3 Compliant |
The MCIMX6U7CVM08AB DualLite processor represents the latest achievement in integrated multimedia-focused products offering high-performance processing with a high degree of functional integration to meet the demands of high-end, advanced industrial and medical applications requiring graphically rich and highly responsive user interfaces. The NXP MCIMX6U7CVM08AB processor features advanced implementation of single/dual Arm? Cortex?-A9 core, which operates at speeds of up to 800 MHz.
2x Arm? Cortex?-A9 up to 1 GHz
512 KB L2 cache
32 KB instruction and data caches
NEON SIMD media accelerator
Multilevel memory system
Dynamic voltage and frequency scaling
Powerful graphics acceleration
Interface flexibility
Integrated power management throughout the device
Advanced hardware-enabled security
Heating Ventilation, and Air Conditioning (HVAC)
Instrument Cluster
Mid to High Infotainment / eCockpit
3-Phase AC Induction Motor
Air Conditioning (AC)
Brushless DC Motor (BLDC) Control
Hearables