Parameters |
Factory Lead Time |
1 Week |
Package / Case |
400-LFBGA |
Operating Temperature |
-40°C~105°C TJ |
Packaging |
Tray |
Published |
2002 |
Series |
i.MX6SLL |
Part Status |
Active |
Moisture Sensitivity Level (MSL) |
3 (168 Hours) |
Peak Reflow Temperature (Cel) |
260 |
Time@Peak Reflow Temperature-Max (s) |
40 |
Speed |
800MHz |
Core Processor |
ARM® Cortex®-A9 |
Voltage - I/O |
1.2V 1.8V 2.5V 3.3V |
Number of Cores/Bus Width |
1 Core 32-Bit |
Graphics Acceleration |
Yes |
RAM Controllers |
LPDDR2, LPDDR3 |
USB |
USB 2.0 OTG + PHY (2) |
Co-Processors/DSP |
Multimedia; NEON™ SIMD |
Security Features |
A-HAB, ARM TZ, CSU, SJC, SNVS |
Display & Interface Controllers |
EPDC, LCD |
RoHS Status |
ROHS3 Compliant |
MCIMX6V2CVM08AB Overview
With a packing size of 400-LFBGA, this embedded microprocessor is ideal for international shipping. Advanced packaging method Tray is used to provide high reliability. The CPU has 1 Core 32-Bit cores/Bus width. The operating temperature around -40°C~105°C TJ should be understood. The i.MX6SLL series contains it. The CPU is powered by a ARM? Cortex?-A9 core. LPDDR2, LPDDR3 RAM controllers are used by this CPU. At 1.2V 1.8V 2.5V 3.3V, the CPU runs its I/O.
MCIMX6V2CVM08AB Features
ARM? Cortex?-A9 Core
MCIMX6V2CVM08AB Applications
There are a lot of NXP USA Inc. MCIMX6V2CVM08AB Microprocessor applications.
- Blood pressure monitors
- Missile control
- Xbox
- Dishwashers
- Light sensing & controlling devices
- Automatic control
- Plant factories (special plant factories, soilless cultivation technology, smart seed engineering)
- Day to day life field
- Monitoring-temperature level, oil level, speed, distance, acceleration
- Pacemakers (used to control abnormal heart rhythm)