Parameters |
Factory Lead Time |
1 Week |
Package / Case |
400-LFBGA |
Operating Temperature |
-40°C~125°C TJ |
Packaging |
Tray |
Series |
i.MX6SX |
Part Status |
Active |
Moisture Sensitivity Level (MSL) |
3 (168 Hours) |
HTS Code |
8542.39.00.01 |
Peak Reflow Temperature (Cel) |
260 |
Time@Peak Reflow Temperature-Max (s) |
40 |
Speed |
200MHz, 800MHz |
Core Processor |
ARM® Cortex®-A9, ARM® Cortex®-M4 |
Voltage - I/O |
1.8V 2.5V 2.8V 3.15V |
Ethernet |
10/100/1000Mbps (2) |
Number of Cores/Bus Width |
2 Core 32-Bit |
Graphics Acceleration |
No |
RAM Controllers |
LPDDR2, LVDDR3, DDR3 |
USB |
USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2) |
Additional Interfaces |
AC'97, CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPDIF, SPI, SSI, UART |
Co-Processors/DSP |
Multimedia; NEON™ MPE |
Security Features |
A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE |
Display & Interface Controllers |
Keypad, LCD |
RoHS Status |
ROHS3 Compliant |
MCIMX6X1AVO08AC Overview
The embedded microprocessor ships overseas conveniently packed in 400-LFBGA. A high level of reliability is provided by using an advanced packaging method Tray. Cores/Bus width is 2 Core 32-Bit. Recognize operating temperatures around -40°C~125°C TJ. This is part of the i.MX6SX series. A ARM? Cortex?-A9, ARM? Cortex?-M4 processor is present in this CPU. There are LPDDR2, LVDDR3, DDR3 RAM controllers used by this CPU. To serve better this microprocessor features AC'97, CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPDIF, SPI, SSI, UART interfaces. As far as I/O is concerned, this CPU runs at 1.8V 2.5V 2.8V 3.15V.
MCIMX6X1AVO08AC Features
ARM? Cortex?-A9, ARM? Cortex?-M4 Core
MCIMX6X1AVO08AC Applications
There are a lot of NXP USA Inc. MCIMX6X1AVO08AC Microprocessor applications.
- Projector
- PDAs, game consoles
- Pacemakers (used to control abnormal heart rhythm)
- Torpedo guidance
- Measurement and control field
- Television
- Fire alarms
- Fire detection & safety devices
- DDC control
- Day to day life field