Parameters |
Factory Lead Time |
1 Week |
Package / Case |
400-LFBGA |
Operating Temperature |
-20°C~105°C TJ |
Packaging |
Tray |
Published |
2014 |
Series |
i.MX6SX |
Part Status |
Active |
Moisture Sensitivity Level (MSL) |
3 (168 Hours) |
HTS Code |
8542.39.00.01 |
Peak Reflow Temperature (Cel) |
260 |
Time@Peak Reflow Temperature-Max (s) |
40 |
Speed |
227MHz, 1GHz |
Core Processor |
ARM® Cortex®-A9, ARM® Cortex®-M4 |
Voltage - I/O |
1.8V 2.5V 2.8V 3.15V |
Ethernet |
10/100/1000Mbps (2) |
Number of Cores/Bus Width |
2 Core 32-Bit |
Graphics Acceleration |
No |
RAM Controllers |
LPDDR2, LVDDR3, DDR3 |
USB |
USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2) |
Additional Interfaces |
AC'97, CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPDIF, SPI, SSI, UART |
Co-Processors/DSP |
Multimedia; NEON™ MPE |
Security Features |
A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE |
Display & Interface Controllers |
Keypad, LCD |
RoHS Status |
ROHS3 Compliant |
MCIMX6X1EVK10AC Overview
Since the microprocessor is packed in 400-LFBGA, shipping overseas is convenient. In order to provide high reliability, advanced packaging method Tray is used. Cores/Bus width is 2 Core 32-Bit. Extended operating temperature around -20°C~105°C TJ. This is part of the i.MX6SX series. ARM? Cortex?-A9, ARM? Cortex?-M4 is the processor core of this CPU. LPDDR2, LVDDR3, DDR3 RAM controllers are used by this CPU. To serve better this microprocessor features AC'97, CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPDIF, SPI, SSI, UART interfaces. In this CPU, I/O is set to 1.8V 2.5V 2.8V 3.15V.
MCIMX6X1EVK10AC Features
ARM? Cortex?-A9, ARM? Cortex?-M4 Core
MCIMX6X1EVK10AC Applications
There are a lot of NXP USA Inc. MCIMX6X1EVK10AC Microprocessor applications.
- Smoke alarms
- Hard drives
- Home appliances
- Embedded gateways
- Medical instruments
- Digital TVs
- Industrial instrumentation devices
- Monitoring-temperature level, oil level, speed, distance, acceleration
- Mobile computers
- Toys