Parameters | |
---|---|
Factory Lead Time | 1 Week |
Package / Case | 400-LFBGA |
Surface Mount | YES |
Operating Temperature | -20°C~105°C TJ |
Packaging | Tray |
Published | 2002 |
Series | i.MX6SX |
JESD-609 Code | e1 |
Part Status | Active |
Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
Number of Terminations | 400 |
ECCN Code | 5A992 |
Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) |
HTS Code | 8542.31.00.01 |
Technology | CMOS |
Terminal Position | BOTTOM |
Terminal Form | BALL |
Peak Reflow Temperature (Cel) | 260 |
Terminal Pitch | 0.8mm |
Time@Peak Reflow Temperature-Max (s) | 40 |
JESD-30 Code | S-PBGA-B400 |
Supply Voltage-Max (Vsup) | 1.5V |
Supply Voltage-Min (Vsup) | 1.35V |
Speed | 227MHz, 1GHz |
uPs/uCs/Peripheral ICs Type | MICROPROCESSOR, RISC |
Core Processor | ARM® Cortex®-A9, ARM® Cortex®-M4 |
Address Bus Width | 15 |
Boundary Scan | YES |
Low Power Mode | YES |
External Data Bus Width | 32 |
Format | FLOATING POINT |
Integrated Cache | YES |
Voltage - I/O | 1.8V 2.5V 2.8V 3.15V |
Ethernet | 10/100/1000Mbps (2) |
Number of Cores/Bus Width | 2 Core 32-Bit |
Graphics Acceleration | Yes |
RAM Controllers | LPDDR2, LVDDR3, DDR3 |
USB | USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2) |
Additional Interfaces | AC'97, CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPDIF, SPI, SSI, UART |
Co-Processors/DSP | Multimedia; NEON™ MPE |
Security Features | A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE |
Display & Interface Controllers | Keypad, LCD, LVDS |
Height Seated (Max) | 1.3mm |
Length | 14mm |
RoHS Status | ROHS3 Compliant |
The MCIMX6X3EVK10AB processor represents NXP Semiconductor’s latest achievement in integrated multimedia-focused products offering high-performance processing with a high degree of functional integration, targeted toward the growing market of connected devices. The MCIMX6X3EVK10AB processor features NXP’s advanced implementation of the single Arm? Cortex?-A9 core, which operates at speeds of up to 1 GHz, in addition to the Arm Cortex-M4 core, which operates at speeds of up to 227 MHz.
Dual-core architecture with one Arm Cortex-A9 processor plus one Arm Cortex-M4 processor
Multilevel memory system
Smart speed technology
Dynamic voltage and frequency scaling
Multimedia powerhouse
Multicore unit includes multi-core isolation and sharing
Graphics rendering for Human Machine Interfaces (HMI)
Audio playback
Connected devices
Access control panels
Human Machine Interfaces (HMI)
Portable medical and health care
IP phones
Smart appliances
Home energy management systems