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MCIMX6X3EVK10ABR

ARM? Cortex?-A9, ARM? Cortex?-M4 Microprocessor i.MX6SX Series 400-LFBGA


  • Manufacturer: NXP USA Inc.
  • Nocochips NO: 568-MCIMX6X3EVK10ABR
  • Package: 400-LFBGA
  • Datasheet: -
  • Stock: 479
  • Description: ARM? Cortex?-A9, ARM? Cortex?-M4 Microprocessor i.MX6SX Series 400-LFBGA (Kg)

Details

Tags

Parameters
Factory Lead Time 1 Week
Package / Case 400-LFBGA
Operating Temperature -20°C~105°C TJ
Packaging Tape & Reel (TR)
Published 2002
Series i.MX6SX
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Speed 227MHz, 1GHz
Core Processor ARM® Cortex®-A9, ARM® Cortex®-M4
Voltage - I/O 1.8V 2.5V 2.8V 3.15V
Ethernet 10/100/1000Mbps (2)
Number of Cores/Bus Width 2 Core 32-Bit
Graphics Acceleration Yes
RAM Controllers LPDDR2, LVDDR3, DDR3
USB USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2)
Additional Interfaces AC'97, CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPDIF, SPI, SSI, UART
Co-Processors/DSP Multimedia; NEON™ MPE
Security Features A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE
Display & Interface Controllers Keypad, LCD, LVDS
RoHS Status ROHS3 Compliant

MCIMX6X3EVK10ABR Overview


With a packing size of 400-LFBGA, this embedded microprocessor is ideal for international shipping. High reliability is achieved by using advanced packaging methods Tape & Reel (TR). There are 2 Core 32-Bit cores per bus width on the CPU. Understand how the operating temperature around -20°C~105°C TJ is determined. From the i.MX6SX series. The CPU is cored by a processor with a number of 0 cores. Memory controllers for this CPU are LPDDR2, LVDDR3, DDR3. Featuring AC'97, CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPDIF, SPI, SSI, UART interfaces, this microprocessor can better serve you. This CPU runs I/O at 1.8V 2.5V 2.8V 3.15V.

MCIMX6X3EVK10ABR Features


ARM? Cortex?-A9, ARM? Cortex?-M4 Core

MCIMX6X3EVK10ABR Applications


There are a lot of NXP USA Inc. MCIMX6X3EVK10ABR Microprocessor applications.

  • 8. Navigation control field
  • Automobile
  • Copiers
  • Printers
  • Robots
  • Heater/Fan
  • Glucose monitoring systems (for Type 1 Diabetes)
  • Industrial instrumentation devices
  • Network communication, mobile communication field
  • DCS control intelligent sensor

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