MCIMX6X3EVN10AC
| Parameters | |
|---|---|
| USB | USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2) |
| Additional Interfaces | AC'97, CAN, I2C, I2S, MMC/SD/SDIO, PCIe, SAI, SPDIF, SPI, SSI, UART |
| Co-Processors/DSP | Multimedia; NEON™ MPE |
| Security Features | A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE |
| Display & Interface Controllers | Keypad, LCD |
| RoHS Status | ROHS3 Compliant |
| Factory Lead Time | 1 Week |
| Package / Case | 400-LFBGA |
| Operating Temperature | -20°C~105°C TJ |
| Packaging | Tray |
| Published | 2014 |
| Series | i.MX6SX |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Peak Reflow Temperature (Cel) | 260 |
| Time@Peak Reflow Temperature-Max (s) | 40 |
| Speed | 227MHz, 1GHz |
| Core Processor | ARM® Cortex®-A9, ARM® Cortex®-M4 |
| Voltage - I/O | 1.8V 2.5V 2.8V 3.15V |
| Ethernet | 10/100/1000Mbps (2) |
| Number of Cores/Bus Width | 2 Core 32-Bit |
| Graphics Acceleration | Yes |
| RAM Controllers | LPDDR2, LVDDR3, DDR3 |
MCIMX6X3EVN10AC Overview
The embedded microprocessor ships overseas conveniently packed in 400-LFBGA. High reliability can be achieved by using the advanced packaging method Tray. There are 2 Core 32-Bit cores per bus width on the CPU. The operating temperature around -20°C~105°C TJ should be understood. It comes from the i.MX6SX series. A ARM? Cortex?-A9, ARM? Cortex?-M4 processor powers this CPU. This CPU uses LPDDR2, LVDDR3, DDR3 RAM controllers. A AC'97, CAN, I2C, I2S, MMC/SD/SDIO, PCIe, SAI, SPDIF, SPI, SSI, UART interface has been added to this microprocessor in order to serve the user better. The CPU runs at 1.8V 2.5V 2.8V 3.15V when it comes to I/O.
MCIMX6X3EVN10AC Features
ARM? Cortex?-A9, ARM? Cortex?-M4 Core
MCIMX6X3EVN10AC Applications
There are a lot of NXP USA Inc. MCIMX6X3EVN10AC Microprocessor applications.
- Washing machines
- Fabric
- Mice
- DVD\DV\MP3 players
- Dryers
- Auto-breaking system
- Missile control
- Xbox
- ECG machine
- X-ray
