Parameters | |
---|---|
Factory Lead Time | 1 Week |
Package / Case | 529-LFBGA |
Surface Mount | YES |
Operating Temperature | -40°C~125°C TJ |
Packaging | Tray |
Published | 2002 |
Series | i.MX6SX |
JESD-609 Code | e1 |
Part Status | Active |
Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
Number of Terminations | 529 |
ECCN Code | 5A992 |
Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) |
HTS Code | 8542.31.00.01 |
Technology | CMOS |
Terminal Position | BOTTOM |
Terminal Form | BALL |
Terminal Pitch | 0.8mm |
JESD-30 Code | S-PBGA-B529 |
Supply Voltage-Max (Vsup) | 1.5V |
Supply Voltage-Min (Vsup) | 1.275V |
Number of I/O | 14 |
Speed | 200MHz, 800MHz |
uPs/uCs/Peripheral ICs Type | MULTIFUNCTION PERIPHERAL |
Core Processor | ARM® Cortex®-A9, ARM® Cortex®-M4 |
Supply Current-Max | 1100mA |
Address Bus Width | 16 |
Boundary Scan | YES |
External Data Bus Width | 32 |
RAM (words) | 144K |
Voltage - I/O | 1.8V 2.5V 2.8V 3.15V |
Ethernet | 10/100/1000Mbps (2) |
Number of Cores/Bus Width | 2 Core 32-Bit |
Graphics Acceleration | Yes |
RAM Controllers | LPDDR2, LVDDR3, DDR3 |
USB | USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2) |
Additional Interfaces | AC'97, CAN, I2C, I2S, MLB, MMC/SD/SDIO, PCIe, SAI, SPDIF, SPI, SSI, UART, VADC |
Number of Serial I/Os | 2 |
Co-Processors/DSP | Multimedia; NEON™ MPE |
Bus Compatibility | CAN; ETHERNET; I2C; I2S; IRDA; PCI; RS-232; RS-485; SPI; UART; USB |
Security Features | A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE |
Display & Interface Controllers | Keypad, LCD, LVDS |
Height Seated (Max) | 1.52mm |
Length | 19mm |
RoHS Status | ROHS3 Compliant |
As the first device utilizing both the Arm? Cortex?-A9 and Cortex-M4 cores, the MCIMX6X4AVM08AB applications processor offers a highly integrated multi-market solution. The MCIMX6X4AVM08AB automotive and infotainment processors represent NXP Semiconductor’s latest achievement in integrated multimedia-focused products offering high-performance processing with a high degree of functional integration. The MCIMX6X4AVM08AB is designed considering the needs of the growing automotive infotainment, telematics, HMI, and display-based cluster markets.
Dual-core architecture with one Arm Cortex-A9 processor plus one Arm Cortex-M4 processor
Multilevel memory system
Smart speed technology
Dynamic voltage and frequency scaling
Interface flexibility
Automotive environment support
Entry Infotainment / Connected Radio
Heating Ventilation, and Air Conditioning (HVAC)
Energy Gateway
Heat Metering
Hearables
Input Device (Mouse, Pen, Keyboard)
Smart Watch