Parameters |
Factory Lead Time |
1 Week |
Package / Case |
289-LFBGA |
Operating Temperature |
0°C~95°C TJ |
Packaging |
Tray |
Published |
2015 |
Series |
i.MX6 |
Part Status |
Active |
Moisture Sensitivity Level (MSL) |
3 (168 Hours) |
HTS Code |
8542.39.00.01 |
Peak Reflow Temperature (Cel) |
260 |
Time@Peak Reflow Temperature-Max (s) |
40 |
Speed |
900MHz |
Core Processor |
ARM® Cortex®-A7 |
Voltage - I/O |
1.8V 2.8V 3.3V |
Ethernet |
10/100Mbps (2) |
Number of Cores/Bus Width |
1 Core 32-Bit |
Graphics Acceleration |
No |
RAM Controllers |
LPDDR2, DDR3, DDR3L |
USB |
USB 2.0 OTG + PHY (2) |
Additional Interfaces |
CAN, I2C, SPI, UART |
Co-Processors/DSP |
Multimedia; NEON™ MPE |
Security Features |
A-HAB, ARM TZ, CSU, SJC, SNVS |
Display & Interface Controllers |
Electrophoretic, LCD |
RoHS Status |
ROHS3 Compliant |
MCIMX6Y7DVM09AB Overview
The embedded microprocessor ships overseas conveniently packed in 289-LFBGA. The packaging method Tray provides high reliability. This CPU has 1 Core 32-Bit cores and 1 Core 32-Bit bus widths. Understand how the operating temperature around 0°C~95°C TJ is determined. The cpu microprocessor belongs to the i.MX6 series. With a core count of ARM? Cortex?-A7, this CPU is multicore. There are LPDDR2, DDR3, DDR3L RAM controllers used by this CPU. With its CAN, I2C, SPI, UART interfaces, this microprocessor will be able to serve you better. The CPU runs I/O at 1.8V 2.8V 3.3V.
MCIMX6Y7DVM09AB Features
ARM? Cortex?-A7 Core
MCIMX6Y7DVM09AB Applications
There are a lot of NXP USA Inc. MCIMX6Y7DVM09AB Microprocessor applications.
- Removable disks
- Routers
- Set-top boxes
- DDC control
- Robotic prosthetic limbs
- Virtual reality VR robots
- 3D printers
- Day to day life field
- Answering machines
- Information appliances (networking of household appliances)