Parameters | |
---|---|
Factory Lead Time | 1 Week |
Package / Case | 541-LFBGA |
Operating Temperature | -20°C~105°C TJ |
Packaging | Tray |
Published | 2012 |
Series | i.MX7S |
Part Status | Active |
Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
HTS Code | 8542.31.00.01 |
Peak Reflow Temperature (Cel) | 260 |
Time@Peak Reflow Temperature-Max (s) | 40 |
Speed | 800MHz |
uPs/uCs/Peripheral ICs Type | MICROPROCESSOR, RISC |
Core Processor | ARM® Cortex®-A7, ARM® Cortex®-M4 |
Voltage - I/O | 1.8V 3.3V |
Ethernet | 10/100/1000Mbps (1) |
Number of Cores/Bus Width | 1 Core 32-Bit |
Graphics Acceleration | No |
RAM Controllers | LPDDR2, LPDDR3, DDR3, DDR3L |
USB | USB 2.0 + PHY (1), USB 2.0 OTG + PHY (1) |
Additional Interfaces | AC'97, CAN, eCSPI, I2C, I2S, MMC/SD/SDIO, PCIe, QSPI, SAI, UART |
Co-Processors/DSP | Multimedia; NEON™ MPE |
Security Features | A-HAB, ARM TZ, CAAM, CSU, SJC, SNVS |
Display & Interface Controllers | Keypad, LCD, MIPI |
RoHS Status | ROHS3 Compliant |
The MCIMX7S5EVM08SD processor represents our latest achievement in high-performance processing for low-power requirements with a high degree of functional integration. The processor MCIMX7S5EVM08SD is targeted towards the growing market of connected devices. The MCIMX7S5EVM08SD processor features our advanced implementation of the Arm? Cortex?-A7 core, which operates at speeds of up to 1 GHz, and the Arm Cortex-M4 core.
Heterogeneous Multicore Processing Architecture, Arm Cortex-A7, and Cortex-M4 configuration
External Memory Support: DDR3/DDR3L/LPDDR2/LPDDR3
Flash Memory Support: NAND (60-bit ECC), Managed NAND (eMMC, eSD)
Single Gigabit ETH controllers supporting AVB
Parallel RGB and MIPI DSI Display Interfaces
Parallel and MIPI CSI Camera Interfaces
Heating Ventilation, and Air Conditioning (HVAC)
Broadband Modem and Residential Gateway
3-Phase AC Induction Motor
Air Conditioning (AC)
Anesthesia Unit Monitor
Blood Glucose Management
Brushless DC Motor (BLDC) Control