MCP23S08T-E/ML
| Parameters | |
|---|---|
| Factory Lead Time | 1 Week |
| Contact Plating | Tin |
| Mounting Type | Surface Mount |
| Package / Case | 20-VFQFN Exposed Pad |
| Surface Mount | YES |
| Operating Temperature | -40°C~125°C |
| Packaging | Tape & Reel (TR) |
| Published | 2007 |
| JESD-609 Code | e3 |
| Feature | POR |
| Pbfree Code | yes |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
| Number of Terminations | 20 |
| ECCN Code | EAR99 |
| Technology | CMOS |
| Voltage - Supply | 1.8V~5.5V |
| Terminal Position | QUAD |
| Terminal Form | NO LEAD |
| Peak Reflow Temperature (Cel) | 260 |
| Supply Voltage | 5V |
| Terminal Pitch | 0.5mm |
| Time@Peak Reflow Temperature-Max (s) | 40 |
| Base Part Number | MCP23S08 |
| Pin Count | 20 |
| JESD-30 Code | R-PQCC-N20 |
| Qualification Status | Not Qualified |
| Output Type | Push-Pull |
| Operating Supply Voltage | 5.5V |
| Power Supplies | 5V |
| Interface | SPI |
| Number of I/O | 8 |
| Number of Ports | 1 |
| Power Dissipation | 700mW |
| Number of Bits | 8 |
| Clock Frequency | 10MHz |
| Interrupt Output | Yes |
| Current - Output Source/Sink | 25mA |
| Height Seated (Max) | 1mm |
| Length | 4mm |
| Width | 4mm |
| RoHS Status | ROHS3 Compliant |
| Lead Free | Lead Free |
See Relate Datesheet
