Parameters | |
---|---|
Factory Lead Time | 1 Week |
Mounting Type | Chassis Mount |
Package / Case | M3 |
Surface Mount | NO |
Diode Element Material | SILICON |
Operating Temperature | -40°C~150°C TJ |
Packaging | Bulk |
Published | 2005 |
Part Status | Active |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
Number of Terminations | 5 |
ECCN Code | EAR99 |
Technology | Standard |
Terminal Position | UPPER |
Terminal Form | UNSPECIFIED |
Peak Reflow Temperature (Cel) | 260 |
Time@Peak Reflow Temperature-Max (s) | 10 |
JESD-30 Code | R-XUFM-X5 |
Number of Elements | 6 |
Configuration | BRIDGE, 6 ELEMENTS |
Diode Type | Three Phase |
Current - Reverse Leakage @ Vr | 500μA @ 1600V |
Voltage - Forward (Vf) (Max) @ If | 1.75V @ 300A |
Case Connection | ISOLATED |
Output Current-Max | 160A |
Current - Average Rectified (Io) | 160A |
Number of Phases | 3 |
Non-rep Pk Forward Current-Max | 1800A |
Voltage - Peak Reverse (Max) | 1.6kV |
Breakdown Voltage-Min | 1600V |
RoHS Status | ROHS3 Compliant |