Parameters | |
---|---|
Factory Lead Time | 1 Week |
Mounting Type | Chassis Mount |
Package / Case | D2 |
Surface Mount | NO |
Diode Element Material | SILICON |
Packaging | Bulk |
Published | 2008 |
Part Status | Active |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
Number of Terminations | 3 |
ECCN Code | EAR99 |
HTS Code | 8541.10.00.80 |
Terminal Position | UPPER |
Terminal Form | UNSPECIFIED |
Peak Reflow Temperature (Cel) | 260 |
Time@Peak Reflow Temperature-Max (s) | 10 |
JESD-30 Code | R-XUFM-X3 |
Operating Temperature (Max) | 150°C |
Number of Elements | 2 |
Speed | Standard Recovery >500ns, > 200mA (Io) |
Diode Type | Standard |
Current - Reverse Leakage @ Vr | 9mA @ 1600V |
Voltage - Forward (Vf) (Max) @ If | 1.4V @ 300A |
Case Connection | ISOLATED |
Operating Temperature - Junction | -40°C~150°C |
Output Current-Max | 165A |
Application | GENERAL PURPOSE |
Voltage - DC Reverse (Vr) (Max) | 1600V |
Current - Average Rectified (Io) | 165A |
Number of Phases | 1 |
Rep Pk Reverse Voltage-Max | 1600V |
Non-rep Pk Forward Current-Max | 6000A |
Diode Configuration | 1 Pair Series Connection |
Reverse Current-Max | 9000μA |
RoHS Status | ROHS3 Compliant |