Parameters | |
---|---|
Factory Lead Time | 1 Week |
Mount | Chassis Mount |
Mounting Type | Chassis Mount |
Package / Case | S-3 Module |
Weight | 170.097139g |
Diode Element Material | SILICON |
Packaging | Bulk |
Published | 2014 |
Part Status | Active |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
Number of Terminations | 3 |
ECCN Code | EAR99 |
Max Operating Temperature | 150°C |
Min Operating Temperature | -40°C |
Additional Feature | PD-CASE, UL RECOGNIZED |
HTS Code | 8541.10.00.80 |
Terminal Position | UPPER |
Terminal Form | UNSPECIFIED |
Reach Compliance Code | unknown |
JESD-30 Code | R-XUFM-X3 |
Number of Elements | 2 |
Power Dissipation-Max | 625W |
Speed | Standard Recovery >500ns, > 200mA (Io) |
Diode Type | Standard |
Current - Reverse Leakage @ Vr | 500μA @ 1800V |
Output Current | 130A |
Voltage - Forward (Vf) (Max) @ If | 1.5V @ 400A |
Case Connection | ISOLATED |
Operating Temperature - Junction | -40°C~150°C |
Application | GENERAL PURPOSE |
Voltage - DC Reverse (Vr) (Max) | 1800V |
Forward Voltage | 1.5V |
Max Reverse Voltage (DC) | 1.8kV |
Average Rectified Current | 130A |
Number of Phases | 1 |
Non-rep Pk Forward Current-Max | 3800A |
Diode Configuration | 1 Pair Series Connection |
Reverse Current-Max | 500μA |
Reverse Voltage (DC) | 1.8kV |
RoHS Status | ROHS3 Compliant |