Parameters | |
---|---|
Mount | Chassis Mount |
Mounting Type | Chassis Mount |
Package / Case | Module |
Number of Pins | 500 |
Diode Element Material | SILICON |
Packaging | Tray |
Published | 2005 |
Pbfree Code | yes |
Part Status | Active |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
Number of Terminations | 3 |
ECCN Code | EAR99 |
HTS Code | 8541.10.00.80 |
Terminal Position | UPPER |
Terminal Form | UNSPECIFIED |
Peak Reflow Temperature (Cel) | NOT SPECIFIED |
Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
Base Part Number | MD*950 |
JESD-30 Code | R-XUFM-X3 |
Qualification Status | Not Qualified |
Operating Temperature (Max) | 150°C |
Operating Temperature (Min) | -40°C |
Number of Elements | 2 |
Element Configuration | Common Anode |
Speed | Standard Recovery >500ns, > 200mA (Io) |
Diode Type | Standard |
Current - Reverse Leakage @ Vr | 50mA @ 1400V |
Voltage - Forward (Vf) (Max) @ If | 880mV @ 500A |
Case Connection | ISOLATED |
Output Current-Max | 1129A |
Application | GENERAL PURPOSE |
Voltage - DC Reverse (Vr) (Max) | 1400V |
Max Reverse Voltage (DC) | 1.4kV |
Average Rectified Current | 950A |
Number of Phases | 1 |
Reverse Recovery Time | 18 μs |
Reverse Voltage | 1.4kV |
Diode Configuration | 1 Pair Common Anode |
RoHS Status | ROHS3 Compliant |