Parameters | |
---|---|
Factory Lead Time | 1 Week |
Mount | Through Hole |
Mounting Type | Through Hole |
Package / Case | 9-DIP Module |
Operating Temperature | -55°C~125°C |
Packaging | Tray |
Published | 2014 |
Series | VI Chip® DCM® (500W) |
Size / Dimension | 1.88Lx0.90W x 0.29 H 47.7mmx22.8mmx7.3mm |
Feature | Remote On/Off, OCP, OTP, OVP, SCP, UVLO |
Part Status | Active |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
Number of Terminations | 9 |
ECCN Code | EAR99 |
Type | Isolated Module |
Applications | ITE (Commercial) |
Power (Watts) | 500W |
Max Power Dissipation | 500W |
Technology | HYBRID |
Terminal Position | DUAL |
Number of Functions | 1 |
JESD-30 Code | R-XDMA-T9 |
Number of Outputs | 1 |
Efficiency | 93.1% |
Voltage - Isolation | 4.242kV |
Voltage - Input (Max) | 420V |
Output Voltage | 24V |
Max Output Current | 20.83A |
Voltage - Output 1 | 24V |
Voltage - Input (Min) | 160V |
Input Voltage-Nom | 270V |
Trim/Adjustable Output | NO |
Height | 7.366mm |
Width | 22.8mm |
RoHS Status | ROHS3 Compliant |
Lead Free | Lead Free |