MDT275M01001
| Parameters | |
|---|---|
| Factory Lead Time | 1 Week |
| Contact Material | Copper Alloy |
| Mount | Surface Mount |
| Mounting Type | Surface Mount, Right Angle |
| Material - Insulation | Liquid Crystal Polymer (LCP) |
| Operating Temperature | -40°C~80°C |
| Packaging | Tape & Reel (TR) |
| Series | M.2 |
| Feature | Board Lock, Keyed |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
| Termination | Solder |
| ECCN Code | EAR99 |
| Connector Type | CARD EDGE CONNECTOR |
| Number of Positions | 67 |
| Color | Black |
| Number of Rows | 2 |
| Gender | Female |
| HTS Code | 8536.69.40.40 |
| Subcategory | Headers and Edge Type Connectors |
| Pitch | 0.020 0.50mm |
| Total Number of Contacts | 75 |
| Reach Compliance Code | unknown |
| Number of Conductors | ONE |
| Reference Standard | UL |
| Contact Finish | Gold |
| Reliability | COMMERCIAL |
| Body Length or Diameter | 0.866 inch |
| Number Of PCB Rows | 2 |
| PCB Contact Pattern | STAGGERED |
| Rated Current (Signal) | 0.5A |
| Contact Resistance | 55mOhm |
| Read Out | Dual |
| Insulation Resistance | 500000000Ohm |
| Dielectric Withstanding Voltage | 300VAC V |
| PCB Contact Row Spacing | 7.5438 mm |
| Contact Pattern | STAGGERED |
| Contact Finish Thickness | 30.0μin 0.76μm |
| Plating Thickness | 30μin |
| RoHS Status | RoHS Compliant |
MDT275M01001 Overview
The material was packaged according to the specifications provided by Tape & Reel (TR).Recommended mounting type is Surface Mount, Right Angle.Using the connector socket CARD EDGE CONNECTOR is how the device is connected.Features of the device are Board Lock, Keyed.It is indicated by the M.2 that the device belongs to a certain series.
MDT275M01001 Features
M.2 series
MDT275M01001 Applications
There are a lot of Amphenol ICC (Commercial Products) MDT275M01001 Edgeboard Connectors applications.
- Medical Instrumentation and medical imaging
- Multiplexed Data Acquisition Systems
- Transducer
- High Speed Data Acquisition for PCs
- TD-SCDMA, WiMAX
- Communication Systems
- Broadband data applications
- Imaging Systems
- In-building wireless telephony
- Automotive
